Nano-scale Conductive Films for High Performance Fine Pitch Interconnect
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Nano-Scale Conductive Films for High Performance Fine Pitch Interconnect Yi Li, Myung Jin Yim, Kyung Sik Moon, and ChingPing Wong School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, GA, 30332-0245
ABSTRACT In this paper, a novel nano-scale conductive film which combines the advantages of both traditional anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) is introduced and developed for next generation high performance ultra-fine pitch packaging applications. This novel interconnect film possesses the properties of electrical conduction along the z-direction with relatively low bonding pressure (ACF-like) and the ultra-fine pitch (< 100 nm) capability (NCF-like). Unlike typical ACF which requires 1-5 vol% of conductive fillers, the novel nano-scale conductive film only needs less than 0.1 vol% conductive fillers to achieve good electrical conductance in the z direction. The nano-scale conductive film also allows a lower bonding pressure than NCF to achieve a much lower joint resistance (over two orders of magnitude lower than typical ACF joints) and higher current carrying capability. With low temperature sintering of nano-silver fillers, the joint resistance of the nano-scale conductive film could be as low as 10-5 Ohm, even lower than the NCF and leadfree solder joints. The reliability of the nano-scale conductive film after high temperature and humidity test (85oC /85%RH) was also improved compared to the NCF joints. As such, a high performance, fine pitch conductive film was developed. INTRODUCTION Recently, anisotropic conductive adhesives/films (ACAs/ACFs) and nonconductive adhesives/films (NCAs/NCFs) are becoming popular due to their technical advantages such as fine pitch capability (
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