On-Chip Power Delivery and Management
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and manageme
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On-Chip Power Delivery and Management Fourth Edition
On-Chip Power Delivery and Management
Inna P.-Vaisband • Renatas Jakushokas Mikhail Popovich • Andrey V. Mezhiba Selçuk Köse • Eby G. Friedman
On-Chip Power Delivery and Management Fourth Edition
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Inna P.-Vaisband University of Rochester Rochester, NY, USA
Renatas Jakushokas Qualcomm Corporation San Diego, CA, USA
Mikhail Popovich Qualcomm Corporation San Marcos, CA, USA
Andrey V. Mezhiba Intel Corporation Hillsboro, OR, USA
Selçuk Köse University of South Florida Tampa, NY, USA
Eby G. Friedman University of Rochester Rochester, USA
ISBN 978-3-319-29393-6 DOI 10.1007/978-3-319-29395-0
ISBN 978-3-319-29395-0 (eBook)
Library of Congress Control Number: 2016936678 © Springer International Publishing Switzerland 2016 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer International Publishing AG Switzerland
To Sasha and Eva To Victoria and Daniel To Oksana, Elizabeth, and JulieAnn To Elizabeth To the memory of my late father, Nurettin Köse To Laurie, Joseph, Shlomit, and Samuel
Preface to the Fourth Edition
Novel market segments such as intelligent transportation, revolutionary health care, sophisticated security systems, and smart energy have recently emerged, requiring increasingly diverse functionality such as RF circuits, power control, passive components, sensors/actuators, biochips, optical communication, and microelectromechanical devices. Integration of these non-digital functionalities at the board-level into system platforms such as systems-in-package (SiP), systems-on-chip (SoC), and three-dimensional (3-D) systems is a primary near- and long-term challenge of the semiconductor industry. The delivery and management of high-quality, highly efficient power have become primary design issues in these functionally diverse systems. Integrated in-package and distributed on-chip power deliver