Packaging of High Power Semiconductor Lasers
This book introduces high power semiconductor laser packaging design. The characteristics and challenges of the design and various packaging, processing, and testing techniques are detailed by the authors. New technologies, in particular therm
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Xingsheng Liu Wei Zhao Lingling Xiong Hui Liu
Packaging of High Power Semiconductor Lasers
Micro- and Opto-Electronic Materials, Structures, and Systems
Series Editor E. Suhir University of California, Santa Cruz, CA, USA
For further volumes: http://www.springer.com/series/7493
Xingsheng Liu • Wei Zhao • Lingling Xiong Hui Liu
Packaging of High Power Semiconductor Lasers
Xingsheng Liu Focuslight Technologies Co., Ltd Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences Shaanxi, People’s Republic of China
Wei Zhao Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences Shaanxi, People’s Republic of China
Lingling Xiong Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences Shaanxi, People’s Republic of China
Hui Liu Xi’an Institute of Optics & Precision Mechanics Chinese Academy of Sciences Shaanxi, People’s Republic of China
ISBN 978-1-4614-9262-7 ISBN 978-1-4614-9263-4 (eBook) DOI 10.1007/978-1-4614-9263-4 Springer New York Heidelberg Dordrecht London Library of Congress Control Number: 2014933785 © Springer Science+Business Media New York 2015 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. Exempted from this legal reservation are brief excerpts in connection with reviews or scholarly analysis or material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work. Duplication of this publication or parts thereof is permitted only under the provisions of the Copyright Law of the Publisher’s location, in its current version, and permission for use must always be obtained from Springer. Permissions for use may be obtained through RightsLink at the Copyright Clearance Center. Violations are liable to prosecution under the respective Copyright Law. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. While the advice and information in this book are believed to be true and accurate at the date of publication, neither the authors nor the editors nor the publisher can accept any legal responsibility for any errors or omissions that may be made. The publisher makes no warranty, express or implied, with respect to the material contained herein. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
Over the past decades, laser technologies have developed tremendously and are playing a
