Plasma-Enhanced Chemical Vapor Deposition of FSG and a-C:F Low-k Materials
Although multilevel interconnection technology is a key to the production of high-performance ultra-large-scale integration (ULSI) circuits, the shrinking design rule of ULSI circuits has recently increased the interconnection delay caused by parasitic ca
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advanced microelectronics
Springer-Verlag Berlin Heidelberg GmbH
9
Springer Series in
advanced microelectronics Series editors: K. Itoh
T. Lee
T. Sakurai
D. Schmitt-Landsiedel
The Springer Series in Advanced Microelectronics provides systematic information on all the topics relevant for the design, processing, and manufacturing of microelectronic devices. The books, each prepared by leading researchers or engineers in their f ields, cover the basic and advanced aspects of topics such as wafer processing, materials, device design, device technologies, circuit design, VLSI implementation, and subsystem technology. The series forms a bridge between physics and engineering and the volumes will appeal to practicing engineers as well as research scientists.
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Cellular Neural Networks Chaos, Complexity and VLSI Processing By G. Manganaro, P. Arena, and L. Fortuna Technology of Integrated Circuits By D. Widmann, H. Mader, and H. Friedrich Ferroelectric Memories By J.F. Scott Microwave Resonators and Filters for Wireless Communication Theory, Design and Application By M. Makimoto and S. Yamashita VLSI Memory Chip Design By K. Itoh High-Frequency Bipolar Transistors Physics, Modelling, Applications By M. Reisch Noise in Semiconductor Devices Modeling and Simulation By F. Bonani and G. Ghione Logic Synthesis for Asynchronous Controllers and Interfaces By J. Cortadella, M. Kishinevsky, A. Kondratyev, L. Lavagno, and A. Yakovlev Low Dielectric Constant Materials for IC Applications Editors: P.S. Ho, J. Leu, W.W. Lee
Series homepage – http://www.springer.de/phys/books/ssam/
P.S. Ho J. Leu W.W. Lee (Eds.)
Low Dielectric Constant Materials for IC Applications With 163 Figures
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Professor Paul S. Ho
Wei William Lee
Texas Materials Institute The University of Texas at Austin Austin, TX 78712, USA e-mail: [email protected]
Taiwan Semiconductor Manufacturing Co. (TSMC), No. 9, Creation Road 1 Science-Based Ind. Park, Hsin-chu, Taiwan e-mail: [email protected]
Jihperng (Jim) Leu Intel Corp., MS: RA1-204 5200 N.E. Elam Young Parkway Hillsboro, OR 97214, USA e-mail: [email protected]
Series Editors:
Dr. Kiyoo Itoh Hitachi Ltd., Central Research Laboratory, 1-280 Higashi-Koigakubo Kokubunji-shi, Tokyo 185-8601, Japan
Professor Thomas Lee Stanford University, Department of Electrical Engineering, 420 Via Palou Mall, CIS-205 Stanford, CA 94305-4070, USA
Professor Takayasu Sakurai Center for Collaborative Research, University of Tokyo, 7-22-1 Roppongi Minato-ku, Tokyo 106-8558, Japan
Professor Doris Schmitt-Landsiedel Technische Universit¨at M¨unchen, Lehrstuhl f¨ur Technische Elektronik Theresienstrasse 90, Geb¨aude N3, 80290 München, Germany
ISSN 1437-0387 ISBN 978-3-642-63221-1 ISBN 978-3-642-55908-2 (eBook) DOI 10.1007/978-3-642-55908-2 Library of Congress Cataloging-in-Publication Data: Low dielectric constant materials for IC applications/ P.S. Ho, J. Leu, W.W. Lee (eds.). p. cm. – (Springer series in advanced microelectronics, ISSN 1437-0387; 9) Includes bibliographical references
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