Preparation of gold-decorated silver nanowires for improving conductivity of electrically conductive adhesives
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Preparation of gold‑decorated silver nanowires for improving conductivity of electrically conductive adhesives Jing Lu1 · Tianlong Han2 · Junfu Dai3 Received: 22 January 2020 / Accepted: 14 July 2020 / Published online: 6 August 2020 © Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract Excellent electrical conductivity generally conflicts with high lap shear strength for electrically conductive adhesives (ECAs). One-dimensional silver nanowires (AgNWs) as conductive fillers can effectively solve the problem. However, insulating ligands on the nanowires will form a large contact resistance between the nanowires and limit the electrical conductivity of ECAs. In this work, we reported a one-step method to prepare Au-decorated AgNW conductive fillers. Through controlling the filler content, curing temperature, and curing time, the ECAs filled with Au-decorated AgNWs obtained exceptional electrical performance. When the filler content was 39 wt%, the resistivity reached to 7.8 × 10−5 Ω cm, which had a strong competitiveness to tin–lead solder. Therefore, the feature opens up possibilities for ECAs filled with the hybrid nanofiller to completely replace traditional solder.
1 Introduction Electrically conductive adhesives (ECAs) possessing environmental friendliness, low curing temperatures, simple process steps, and high resolution for fine-pitch interconnection capability have attracted considerable attention from researchers [1–4]. Currently, ECAs are considered as the most promising next-generation interconnection materials to replace traditional tin/lead solder [5–7]. A typical ECA composed of a polymer matrix and conductive fillers. The polymer matrix can provide sufficiently adhesive strength between conductive tracks and substrates and conductive fillers can significantly improve the electrical performance of ECAs [8, 9]. However, there are still contradictory for achieving both high electrical conductivity and strong adhesion. The ECAs with high loadings can exhibit excellent electrical performance, but also leads to low lap sheer * Jing Lu [email protected] * Junfu Dai [email protected] 1
School of Reliability and Systems Engineering, Beihang University, Beijing 100191, China
2
China Academy of Aerospace Standardization and Product Assurance, Beijing 100071, China
3
Shengyang 4435 Microelectronics Co. Ltd., Shengyang 110034, China
strength [10]. In addition, the cost of ECAs will increase at a high filler content, which limits their application range in electronic industry. Therefore, it is greatly desirable to reduce the filler content while maintaining the superior electrical conductivity. One feasible approach to this problem is improving the aspect ratio of fillers and building a large number of effective conductive paths with low filler content [11–14]. Recently, one-dimensional nanostructures have been incorporated as conductive fillers, which could decrease the percolation threshold and obtain high electrical conductivity at low content of conductive fillers. Am
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