Process development and characterization towards microstructural realization using laser micromachining for MEMS
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Process development and characterization towards microstructural realization using laser micromachining for MEMS Masri Zairi Mohd Zin1 · Elden Harrison Felix1 · Yufridin Wahab1 · Muhamad Nasir Bakar1 Received: 14 February 2020 / Accepted: 7 April 2020 © Springer Nature Switzerland AG 2020
Abstract This paper presents the process development and characterization towards microstructural realization using laser micromachining for MEMS. Laser micromachining technique is environmental friendly, fast patterning and able to avoid multi steps in conventional lithography based microfabrication techniques. This research focuses on understanding the dimensional properties of materials of the laser beam on the silicon wafers where microstructures were fabricated. Four main parameters like rectangular variable aperture (RVA-XY) size, number of pulse, stage/table feed rate and laser energy play important role in laser ablation process. The pattern of the microchannel or line with 1 cm length was drawn by AutoCAD software or any CAD software. The pattern in the CAD software is then transferred onto the silicon wafer by using laser micromachining. Finally, high power microscope (HPM) and Stylus Profiler will be used as measurement tools for observing and analysing the width and depth of the microchannel structures fabricated by laser micromachining. When using bigger size of RVA, it will lead to bigger microchannel width. There are a little effects or almost comparable in term of microchannel depth if varying all parameters’ value. Surface roughness test also needs to be considered before choosing the best setting for the laser ablation. Keywords Laser · Micromachining · Parameter · Microstructure
1 Introduction Chip design and fabrication are getting more complex and compact due to their size. It starts from small scale integrated (SSI) circuit to very large scale integrated (VLSI) circuit and then integration with microelectromechanical system (MEMS). Standard steps to fabricate MEMS like using microelectronic manufacturing methods such as photolithography, etching and deposition [1–5]. Further study should be carried out for looking alternative technique to produce 3 dimension (3D) micro-components with less cost, better durability, better surface roughness and better strength [6–10]. One of the methods that can be used is micromachining methods. Some of micromachining methods consist of MEMS lithography, deep reactive ion and wet etching,
vapour phase etch process, porous silicon-based MEMS, micro 3D technologies, laser-based micromachining, surface and bulk micromachining. Laser ablation also known as laser micromachining, is usually used to remove material from solid state by laser irradiation. There are several types of laser that can be used for micromachining, for examples like yttrium–aluminium–garnet (YAG), carbon dioxide (CO2) and excimer [11, 12]. In this study, KrF excimer laser micromachining with wavelength of 248 nm will be used. In laser micromachining, a laser beam is aimed firmly on the surface of the ma
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