Materials & Process Integration for MEMS
The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and proce
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MICROSYSTEMS Volume 9 Series Editor
Stephen D. Senturia Massachusetts Institute of Technology
Editorial Board
Roger T. Howe, University of California, Berkeley D. Jed Harrison, University ofAlberta Hiroyuki Fujita, University of Tokyo Jan-Ake Schweitz, Uppsala University OTHER BOOKS IN THE SERIES: Methodology for the Modelling and Simulation of Microsystems Bartlomiej F. Romanowicz Hardbound, ISBN 0-7923-8306-0, October 1998 Microcantilevers for Atomic Force Microscope Data Storage Benjamin W. Chui Hardbound, ISBN 0-7923-8358, October 1998 Bringing Scanning Probe Microscopy Up to Speed Stephen C. Mione, Scott R. Manalis, Calvin F. Quate Hardbound, ISBN 0-7923-8466-0, February 1999 Micromachined Ultrasound-Based Proximity Sensors Mark R. Hornung, Oliver Brand Hardbound, ISBN 0-7923-8508-X, April 1999 Microfabrication in Tissue Engineering and Bioartificial Organs Sangeeta Bhatia Hardbound, ISBN 0-7923-8566-7, August 1999 Microscale Heat Conduction in Integrated Circuits and Their Constituent Films Y. Sungtaek Ju, Kenneth E. Goodson Hardbound, ISBN 0-7923-8591-8, August 1999 Scanning Probe Lithography Hyongsok T. Soh, Kathryn Wilder Guarini, Calvin F. Quate Hardbound, ISBN 0-7923-7361-8, June 2001 Optical MicroScanners and Microspectrometers using Thermal Bimoph Actuators Gerhard Lommel, Sandra Schweizer, Philippe Renaud Hardbound, ISBN 0-7923-7655-2, January 2002
Materials & Process Integration forMEMS edited by
Francis E.H. Tay The National University of Singapore
SPRINGER SCIENCE+BUSINESS MEDIA, LLC
A C.I.P. Catalogue record for this book is available from the Library of Congress.
ISBN 978-1-4419-5303-2 ISBN 978-1-4757-5791-0 (eBook) DOI 10.1007/978-1-4757-5791-0
Printed on acid-free paper
All Rights Reserved © 2002 Springer Science+Business Media New York
Originally published by Kluwer Academic Publishers, Boston in 2002 No part of this work may be reproduced, stored in a retrieval system, or transmitted in any form or by any means, electronic, mechanical, photocopying, microfilming, recording or otherwise, without written permission from the Publisher, with the exception of any material supplied specifically for the purpose of being entered and executed on a computer system, for exclusive use by the purchaser of the work.
Contents
v
Contributors Acknowledgements
IX
Foreword
Xl
xiii
Preface
1.
Integration of Piezoelectric Pb (ZrxTi 1_x)03 (PZT) Thin Films into Micromachined Sensors and Actuators
Paul Muralt, Nicolas Ledermann, Jacek J. Baborowski and Sandrine Gentil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.
Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding
A. Prochaska, S. J. N. Mitchell and H. S. Gamble . . . . . . .. 3.
3
27
GaAs Cantilever and Bridge Membrane-Like Structures Fully Compatible with AlGaAs/InGaAs/GaAs and InGaP/InGaAs/GaAs Based HFETs
T. Lalinsky, M. Drzik, L. Matay, I. Kostic, Z. Mozolova, S. Hascik and A. Krajcer . . . . . . . . . . . . . . . . . . . . .. . . . . . . . . .
