An Evaluation on The Effects of Newly Designed Abrasives in CMP Slurry
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An Evaluation on The Effects of Newly Designed Abrasives in CMP Slurry Nobuo Kawahashi, and Masayuki Hattori, Fine Electronic Research Laboratory, JSR Corporation 100 Kawajiri-cho, Yokkaichi, Mie, 510-8552 JAPAN ABSTRACT Newly designed abrasives with various particle morphology and component have been prepared and evaluated in terms of polish efficiency for CMP application. Polymer sphere with uniformed particle size and special functional group were prepared by soap-free emulsion polymerization. CMP slurry including polymer abrasives indicated characteristic properties such as dishing, erosion and low defectivity for metal and dielectric surface. This study has been also conducted on the preparation of composite particles consisting of polymer core covered with inorganic composition such as zirconium compound, titanium compound, SiO2 and Al2O3. The controlled hydrolysis and heterocoagulation systems were proposed as preparation methods of composite particles. 1st step Cu-CMP Slurry with composite particles as abrasion indicated an excellent dishing, erosion and their over-polish-margin. Particularly these composite particles were useful to prevent increasing scratch on the TEOS and low-k dielectric materials surface in 2nd step CMP process. INTRODUCTION As it is well known, chemical mechanical polishing (CMP) is one of the important processes for micro-fabricating Cu damascene interconnects. Since conventional CMP slurry contain hard abrasives such as fumed silica and alumina, it generates many scratches easily not only on Cu line but also on a SiO2 film surface. The SiO2 surface damage generated at the end of barrier metal degrades breakdown reliability. Conventional CMP slurries also cause big issues of Cu dishing and SiO2 erosion in the area of high pattern density [1]. Therefore it is very difficult to fabricate high-density multilevel interconnects at a high yield. When low-k materials are applied to dielectric layer, these issues will be particularly so serious. On the other hand, our previous papers have been published on the preparation of composite particles consisting of polymer cores covered with inorganic shells. In order to minimize the damage for SiO2 and low-k films, the erosion and dishing, new concept slurry with composite particles as abrasive is proposed. The use of composite particles not only for 1st step slurry but also for 2nd step (barrier metal) slurry is considered to be very promising because it avoids these issues.
EXPERIMANTAL DETAILS A. Preparation of abrasives Polymer lattices as core Polymer spheres, used as core particles, were prepared by using conditions described previously. [2] M2.2.1
Composite particles This study provided several types of composite particles consisting of polymer core covered with inorganic composition such as zirconium compound, titanium compound, SiO2 and Al2O3. The controlled hydrolysis and hetero coagulation system were proposed as preparation methods of composite particles described in our papers and patents. [2-10] The coverage, morphology and state o
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