Direct writing of electronic and sensor materials using a laser transfer technique
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R.C.Y. Auyeung and H.D. Wu SFA, Inc., Largo, Maryland 20774
S. Lakeou University of the District of Columbia, Washington, DC 20008
Viet Nguyen and R. Chung Geo-Centers, Inc., Ft. Washington, Maryland 20744
M. Duignan Potomac Photonics, Inc., Lanham, Maryland 20706 (Received 7 April 2000; accepted 6 July 2000)
We present a laser-based direct write technique termed matrix-assisted pulsed-laser evaporation direct write (MAPLE DW). This technique utilizes a laser transparent fused silica disc coated on one side with a composite matrix consisting of the material to be deposited mixed with a laser absorbing polymer. Absorption of laser radiation results in the decomposition of the polymer, which aids in transferring the solute to an acceptor substrate placed parallel to the matrix surface. Using MAPLE DW, complex patterns consisting of metal powders, ceramic powders, and polymer composites were transferred onto the surfaces of various types of substrates with
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