Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface
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ORIGINAL PAPER
Investigation on Slicing Behavior of Single Crystal Silicon Wafer in AWJM and Influence of Micro Dimple Textured Surface for Solar Applications S. Oliver Nesa Raj 1 & S. Prabhu 1 Received: 29 May 2020 / Accepted: 6 October 2020 # Springer Nature B.V. 2020
Abstract The current investigation focuses on the slicing characteristics of silicon, a hard and brittle solid that is very difficult to cut, with abrasive water jet machining (AWJM) process by varying different operational parameters like abrasive flow rate (QA), traverse rate (TR), water pressure (P) and stand-off distance (SOD). The trials were carried out based on Taguchi L9 orthogonal array with multi-response characteristics optimization using the Technique of Order Preference Similarity to the Ideal Solution (TOPSIS) approach. The main effect plot is drawn for the relative closeness coefficient (Cn*) and TOPSIS. The most favorable combinations of the experiment are obtained from the response diagram, traverse rate at level 3, abrasive flow rate at level 3, water pressure at level 3 and standoff distance at level 1 for minimizing the surface roughness, and maximizing the Material Removal Rate (MRR) and flatness. A Field Emission Scanning Electron Microscope (FESEM) and Atomic force microscopy (AFM) study were carried out to observe the quality of the obtained sliced surfaces. The optical characteristics like reflectance and absorption of the laser textured and sliced surfaces are measured using a UV-VIS spectrophotometer, which reveals the significant enhancement in the optical properties, in the case of the laser textured surface. Keywords AWJM . Relative closeness coefficient (Ci+) . TOPSIS . Texturing . SEM . AFM
Nomenclature D dimension of fractal L(r) length of the corresponding curve, mm N number of data points N(r) number of measurements taken r length of the measurement scale, mm Ra surface roughness, μm RRms root mean square method of surface roughness, μm Z mean height, mm Zn height of the data points, mm
* S. Prabhu [email protected] S. Oliver Nesa Raj [email protected] 1
Department of Mechanical Engineering, SRM Institute of Science and Technology, Chennai 603203, India
1 Introduction Single crystal silicon is one of the most commonly used materials in the solar and electronics industry to produce hi-tech products that demand high, stability and conversion efficiency. Slicing of silicon ingots is done with abrasive contact methods like ID blade and multi-wire saw, which result in surface micro-cracks or other damages to the wafer leading to degradation of strength of the silicon slice [1, 3]. To overcome the above drawbacks, the slicing velocity must be diminished (3 and 12 mm/s) as it slows down the process proportional to the wafer’s thickness [3]. Abrasive water jet machining (AWJM) is one of the non-contact, flexible materialremoval processes capable of cutting hard, non-conducting materials used in electronic components. The process avoids the common drawbacks like heat or mechanical distortion associated with ot
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