New Method for Determining and Predicting Test Interconnect Pin Current Carrying Capacity
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New Method for Determining and Predicting Test Interconnect Pin Current Carrying Capacity Eli Gurevich 1
&
Pranit Deshmukh 1
Received: 16 August 2018 / Accepted: 15 July 2020 / Published online: 19 August 2020 # Springer Science+Business Media, LLC, part of Springer Nature 2020
Abstract With new advances in the semiconductor technology, current carrying requirements for electronic packages and interconnects (sockets) are on the rise. Although there are a lot of documented methods for determining current carrying capacity (CCC) of electrical wires, there is no specific industry standard for determining current carrying capacity of socket pins and their contact interface with package balls and pads. This paper presents a new current carrying capacity measurement method, developed specifically to address the challenges of test socket pins and their contact interface with solder balls and pads. In addition, a method for predicting CCC in future test socket pins is presented and correlated to measured data. Keywords Test socket . Contact resistance . Socket pins . Interconnect contact resistance . Current carrying capacity
Nomenclature a, b, c Quadratic polynomial coefficients Ipin _ measured Measured current flowing through the pin, A. Ipin _ derated Measured current flowing through the pin derated for tool test temperature and factor of safety, A Tpin _ at _ room Measured pin temperature at room temperature, °C Tpin _ at _ test Measured pin temperature at test tool temperature, °C Ttest Tester ambient temperature during test, °C Troom Room ambient temperature, °C F20 % _ drop Pin force at 20% drop from the nominal pin force, kg σ Equivalent Von Misses flow stress, Pa εp Equivalent plastic strain ˙ ε˙0 ε*p Strain rate, ε*p ¼ ε= ˙ε Equivalent plastic strain rate, sec−1 ˙ε0 Constant reference strain rate, sec−1. ε˙0 ¼ 0:001 sec−1
AJC BJC CJC nJC mJC TH Tm Tr E1, E2 ν1, ν2 σ1, σ2 hs km
Responsible Editor: H. Manhaeve
k1, k2
* Eli Gurevich [email protected]
m1, m2
1
me
Intel Corporation, Chandler, AZ, USA
Johnson-Cook (J-C) constant representing quasi-static yield stress, MPa J-C constant representing strain hardening effect, MPa Johnson-Cook constant representing strain rate effect Johnson-Cook constant representing strain hardening effect Johnson-Cook constant representing thermal softening effect Homologous temperature ratio defined rÞ as T H ¼ ððTTm−T −T r Þ Melting temperature of the material, K Reference temperature (room temperature), K. Tr = 293 K Young’s modulus of each of the materials in contact, Pa Poisson’s ratio of each of the materials in contact Surface roughness of materials in contact, m Thermal contact conductance of materials in contact, mW2 ⋅K Mean harmonic thermal conductivity of W materials in contact, m⋅K Thermal conductivity of each of the W materials in contact, m⋅K Slope of asperities of each of the materials in contact Effective slope of asperities
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σe P Hv k1, k2 g α γ kg μ Cv λ δ P Hv hg δ g hs hg Ap2p Al2l k F w l Flength R Ec ν G G1, G2 ρ1, ρ2 Pf1, Pf2 η H ρcont dcont
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