Preparation of Copper-coated Mesophase Pitch-based Carbon Fibers by Electroless Plating Technique with the APTES Graftin
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ISSN 1229-9197 (print version) ISSN 1875-0052 (electronic version)
Preparation of Copper-coated Mesophase Pitch-based Carbon Fibers by Electroless Plating Technique with the APTES Grafting Modification Jiangfan Shi1, Yize Liu1, Jianxiao Yang1,2*, Jun Li3, Chong Ye4, Dong Huang4, Jinshui Liu1,2, and Xuanke Li1,2 1
College of Materials Science and Engineering, Hunan University, Changsha 410082, China Hunan Province Key Laboratory for Advanced Carbon Materials and Applied Technology, Hunan University, Changsha 410082, China 3 School of Chemistry and Food Engineering, Changsha University of Science and Technology, Changsha 410114, China 4 Hunan Toyi Carbon Material Technology Co., Ltd., Changsha 410082, China (Received August 17, 2019; Revised November 18, 2019; Accepted December 1, 2019) 2
Abstract: An upgrade synthesis method of electroless copper plating was developed to prepare the copper-coated mesophase pitch-based carbon fibers (Cu@CF) with APTES (3-Aminopropyl triethoxysilane) grafting modification. The microstructure and properties of the fibers which were prepared by the APTES sensitization method were investigated and compared with those prepared by the conventional SnCl2 sensitization method. The results showed that as-coated fibers sensitized by APTES demonstrated to have better interfacial cohesion between the copper layer and the fiber surface than those sensitized by SnCl2 did. Moreover, the resistivity of Cu@CF-APTES declined to 2.3±0.9 μΩ·cm, while that of Cu@CF-SnCl2 was 9.3±3.7 μΩ·cm. Besides, not only the strength of Cu@CF-APTES increased, but the strength discreteness of them reduced due to the fact that no peeling phenomenon was observed between the copper layer and fiber during the stretch test. Keywords: Carbon materials, Electrical properties, Mesophase pitch-based carbon fiber, Electroless copper plating, Sensitization
higher mechanical performance. Actually, APTES, a kind of silane coupling agents [YRSi(OR)3-OR3] which can be hydrolyzed to form different functional groups, provides bonding between inorganic materials like glass fibers and Al2O3 etc. Organic group Y improves the compatibility and reactivity between silane and polymers. In addition, Y usually contains N, S or P functional group which forms bonding with several kinds of metal particles, such as Pd, Au and Ag. Furthermore, Xu et al. [5] confirmed the hypothesis that N-Pd coordination bond did exist to increase life expectancy of the activated initiator and improve adhesion of metal deposition on substrates. These conclusions represented the improvements of surface wettability and provided a new idea to modify the surfaces of CF for reference. On the other hand, mesophase pitch-based CF have much more ordered crystal orientation to ameliorate transmission of photons and electrons than PAN-based CF [6]. Therefore, we chose the mesophase pitch-based CF sensitized by APTES as the reinforcement phase in this work to prepare Cu@CF by electroless copper plating. Their compositions, surface morphologies, interfacial microstructures,
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