Repair of Flat Panel Display Substrates by Laser Direct Writing of Metallic Platinum, Copper and Aluminum and Insulating
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REPAIR OF FLAT PANEL DISPLAY SUBSTRATES BY LASER DIRECT WRITING OF METALLIC PLATINUM, COPPER AND ALUMINUM AND INSULATING ALUMINUM OXIDE UTILIZING GAS PHASE REACTANTS J. David Casey
and
Richard A. Comunale
Micrion Corporation, One Corporation Way, Peabody, MA 01960
ABSTRACT The identification and repair of defects in flat panel displays (FPD's), most especially liquid crystal, are required to achieve acceptable manufacturing yields and reasonable costs. Laser cutting and laser direct writing, from gas phase reactants, are used to repair opens and shorts in conductor lines of FPD substrates (the Ll laser repair system). This paper details platinum, copper and aluminum deposition processes including deposition parameters, conductivity data, Auger evaluations and microscopy characterizations. Life-study data on repaired, fully assembled FPD's will be presented. Also the laser direct-writing process for aluminum oxide, used to repair dielectric defects and to passivate metal repairs, will be described. Finally, a unique, localized vacuum system (SPOT VACT), specifically engineered for laser deposition on large (500 X 500mm) flat substrates, will be detailed. I.
INTRODUCTION
The development of inspection, testing and defect repair of active matrix liquid crystal displays (AMLCD's) is required to raise manufacturing yields from the present 10-40 percent to a level whose mass-marketing applications such as notebook computers and HDTV are economical. We have developed a repair system (the LI system) for flat panel displays which utilizes laser cutting and laser deposition technologies 11,21 to repair line opens, line shorts and cross-over shorts in bus lines. The success of the LI approach has been exemplified in a recent publication 131 which describes the repair and subsequent satisfactory operation of color, high definition, liquid crystal displays. Our initial deposition processes were the laser direct writing of conductive cobalt 14,5,61 and insulating cobalt oxide 161 lines from gas phase reactants. As the variety in LCD materials and cleaning procedures (for example, substrate cleaning processes) expanded, we developed additional deposition processes, namely Pt161, Cu and Al, to repair LCD's. Additionally, Cu and Al were developed with an eye towards the modification and repair of advanced device packages, such as multi-chip modules. An additional concern now being expressed by AMLCD manufacturers is that repairs to fully fabricated panels will subsequently leave the repaired sites exposed to the liquid crystal medium, a potentially undesirable situation. In response to this concern, we will also report on our present development of aluminum oxide deposition which can be used to isolate these repaired sites from the liquid crystal medium.
Mat. Res. Soc. Symp. Proc. Vol. 282. 01993 Materials Research Society
198
II.
THE LI LCD REPAIR SYSTEM AND SPOT VACTM
laser cutting and laser As mentioned above, the LI system utilizes induced, gas phase deposition technologies to repair line opens, line shorts and cross
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