Significance of Surface Topography on Performance and Lifetime of MEMS Switches and Relays
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Significance of Surface Topography on Performance and Lifetime of MEMS Switches and Relays Lior Kogut and Kyriakos Komvopoulos Department of Mechanical Engineering, University of California, Berkeley, CA 94720 ABSTRACT Switches and relays that have emerged from the microelectromechanical systems (MEMS) technology have the potential to replace traditional solid-state devices due to broader operating temperature range, higher breakdown voltage, and much higher off-state resistance. Interest in MEMS switches and relays has surged recently, principally due to the demonstrated performance in switching radio-frequency signals. However, understanding of the effect of the surface topography on performance and lifetime of these microdevices is rather empirical. Therefore, the objective of this study was to explore the role of surface topography in various physical phenomena encountered at contact interfaces of MEMS switches and relays. Emphasis is given on the dependence of pull-in voltage, electric field, and electrical breakdown on surface topography and interpretation of contact interface phenomena associated with surface erosion and adhesion in the context of surface topography effects. In addition, current obstacles in the study of the influence of the surface topography on the performance of MEMS switches and relays are discussed in light of recent findings. INTRODUCTION MEMS is a rapidly growing interdisciplinary field that enables batch fabrication of miniature electromechanical structures, devices, and systems. MEMS technology leverages existing state-of-the-art integrated circuit (IC) fabrication technologies to produce cost-effective microdevices, which can replace traditional macroscopic devices, provide new features to existing systems, and generate new products. Although traditional MEMS, such as inertial sensors and electrostatic actuators, did not include contacting surfaces, recent advances and envisioned new applications have spurred interest in the fabrication of MEMS operating in contact mode. This is largely due to new developments in MEMS technology, such as selfassembled monolayers, coupled with new market demands. Among several emerging MEMS applications where operation involves surface contact, switches and relays appear to represent the most rapidly growing contact-mode microdevice technology. The use of switches and relays is encountered in various applications including automatic test equipment, radars, and communication systems. Since the initial conceptualization of a microfabricated switch [1], many notable attempts have been made to develop MEMS switches and relays because of recognized inherent advantages over conventional macroscopic devices, such as small size, low power consumption, and high throughput. Additional benefits include high-mass fabrication and integration with other MEMS and electronics on a single die. The potential of MEMS switches and relays to replace traditional solid-state devices stems mainly from the broader operating temperature range, lower power consumption,
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