Synthesis and Characterization of Imide-Oligosiloxanes Hybrid Nanocompisite (Imide HYBRIMER) by Reaction of Nano Amine M
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Synthesis and Characterization of Imide-Oligosiloxanes Hybrid Nanocompisite (Imide HYBRIMER) by Reaction of Nano Amine Modified Oligosiloxane and Dianhydride Tae-Ho Lee *, Jeong Hwan Kim, Ji Hoon Ko and Byeong-Soo Bae Laboratory of Optical Materials and Coating (LOMC), Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST), Daejeon 305-701, Republic of Korea ABSTRACT Imide-oligosiloxanes hybrid nanocomposites (Imide HYBRIMER) were synthesized and their unique structure and thermal and mechanical properties were investigated. Imide HYBRIMER was made by reaction with nano-sized amine oligosiloxane (AO) and dianhydride, where oligosiloxane moieties were cross-linked by imide bonds to form three-dimensional nanocomposite. The AO were prepared from condensation reaction with aminopropyltirmethoxysilane (APTS) and diphenylsilanediol (DPSD) under base catalysts without water and solvents. The preparation of imide HYBRIMER was completed through the thermal imidization of amic acids, which were formed by reaction with amines groups in the AO and two different kinds of dianhydrides. The imide HYBRIMER were stable up to 400oC and thermal expansion coefficients measured by thermo-mechanical analysis (TMA) were varied from 33 to 80 ppm/ oC. Higher thermal stabilities and mechanical strengths could be obtained by incorporating siloxane moieties in hybrid nanocomposites. The imide HYBRIMER, which has three dimensional network, could induce very low birefringence about 0.003, which was lower than that of linear typed polyimides. INTRODUCTION Polyimides are attractive for use of gate dielectrics in organic thin film transistor (OTFT) because of their intrinsic thermal stability and good insulating properties [1]. Gate insulating materials for OTFT need dielectric constant modulations and photo-patternability. Inorganicorganic hybrid materials can be good way to add new functionalities to conventional polyimides. Chemically bonded polyimide-inorganic hybrid materials have been reported for microelectronic and corrosion resistant applications where the organic and inorganic phases were able to mix at the molecular level [2,3]. By incorporation of the inorganic materials such as silica, polysiloxanes and polysilsesquioxanes into the polyimide, the polyimide-inorganic hybrid can have advantageous properties, such as higher thermal stability, higher mechanical strength,
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higher transparency and lower birefringence compared to conventional polyimdes. There were two different approaches to synthesize polyimide-inorganic hybrid materials in view of using inorganic moieties. The first method was to make the polyimde hybrids by sol-gel process, which inorganic components can be incorporated adding a precursor of silica such as TEOS [2]. Inorganic components were generated from molecules and covalent connected with polyimides matrix. The second method was to synthesize hybrid nanocomposites which covalently bonded imide or polyimide tethers coupled with inorganic species s
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