Reliability of Nanoscale Circuits and Systems Methodologies and Circ
Reliability of Nanoscale Circuits and Systems: Methodologies and Circuit Architectures Milos Stanisavljevic Alexandre Schmid Yusuf Leblebici Future integrated circuits are expected to be made of emerging nanodevices and their associated interconnects, but
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Miloš Stanisavljevi´c · Alexandre Schmid · Yusuf Leblebici
Reliability of Nanoscale Circuits and Systems Methodologies and Circuit Architectures
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Miloš Stanisavljevi´c Ecole Polytechnique Fédérale de Lausanne 1015 Lausanne, Switzerland [email protected]
Alexandre Schmid Ecole Polytechnique Fédérale de Lausanne 1015 Lausanne, Switzerland [email protected]
Yusuf Leblebici Ecole Polytechnique Fédérale de Lausanne 1015 Lausanne, Switzerland [email protected]
ISBN 978-1-4419-6216-4 e-ISBN 978-1-4419-6217-1 DOI 10.1007/978-1-4419-6217-1 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2010936070 c Springer Science+Business Media, LLC 2011 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
There’s Plenty of Room at the Bottom Richard P. Feynman
Preface
The invention of integrated circuits and the continuing progress in their manufacturing processes are the fundamental engines for the implementation of semiconductor technologies that support today’s information society. The vast majority of microelectronic applications presented nowadays exploit the well-established CMOS process and fabrication technology which exhibit high reliability rates. During the past few decades, this fact has enabled the design of highly complex systems, consisting of several millions of components, where each one of these components could be deemed as fundamentally reliable, without the need for extensive redundancy. The steady downscaling of CMOS technology has led to the development of devices with nanometer dimensions. Future integrated circuits are expected to be made of emerging nanodevices and their associated interconnects. The expected higher probabilities of failures, as well as the higher sensitivities to noise and variations, could make future integrated circuits prohibitively unreliable. The systems to be fabricated will be made of unreliable components, and achieving 100% correctness of operation not only will be extremely costly, but may turn out to become impossible. The global picture depicts reliability emerging as one of the major threats to the design of future integrated computing systems. Building reliable systems out of unreliable components requires increased cooperative involvement of the
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