Self-encapsulated DC MEMS switch using recessed cantilever beam and anodic bonding between silicon and glass
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TECHNICAL PAPER
Self-encapsulated DC MEMS switch using recessed cantilever beam and anodic bonding between silicon and glass Bhagaban Behera1 • Saakshi Dhanekar1
•
Gurpartap Singh1 • Sudhir Chandra2
Received: 10 June 2020 / Accepted: 25 July 2020 Ó Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract In the present work, we report design, fabrication and testing of a novel DC MEMS switch incorporating a self-encapsulated and recessed micro-cantilever beam. Wafer level anodic bonding with press-on contacts between silicon and glass is used innovatively to secure the recessed cantilever beam from one side. The cantilever is made of single crystal silicon in a recessed cavity whereas actuating electrode and signal lines are formed on corning glass. Anodic bonding provides ‘‘press on contacts’’ between silicon and glass plate and also secures the cantilever beam in the recessed cavity in silicon. The signal lines and pull-in electrode are formed on the glass plate using aluminium metallization while the cantilever has a gold pad at its tip. The anodic bonding provides three major advantages (i) it encapsulates the fragile beam and thus protects it from damage during dicing and packaging process (ii) it provides press-on contact between signal lines on glass plate and bonding pads on silicon (iii) it makes the beam optically visible. The devices were simulated using COMSOL multiphysics software and the results were compared with experimentally measured values. The cantilever based switch operates at low actuation voltage (average * 12 V) indicating that it can be used for power electronic circuits and various other applications.
1 Introduction In recent years, microelectromechanical system (MEMS) technology has emerged as driving force for the development of miniaturized and low-power mechanical systems. One such example is the micro-switch which is based on actuation of microbeams/cantilever (Gupta (1997)). There are several ways to actuate a microcantilever such as: electrostatic, thermal and magnetic (Gupta 1997; Gorthi et al. 2006; Dellaert and Doutreloigne 2016; Glickman et al. 2011). However, in majority of these devices, electrostatic actuation is preferred because of its simplicity, high efficiency in terms of force exerted, ease of integration and excellent compatibility with MEMS fabrication steps (Ya et al. 2013; Li et al. 2017). Other than switching devices, cantilevers have also been used in several sensing & Bhagaban Behera [email protected] 1
2
Centre for Applied Research in Electronics (CARE), Indian Institute of Technology Delhi, Hauz Khas, New Delhi 110016, India Bennett University, Uttar Pradesh, Plot No. 8-11, Tech ZoneII, Greater Noida 201310, India
and actuating applications (Hansen and Thundat 2005; Lang et al. 2005; Thundat et al. 1997). Thus, researchers are exploring newer application of cantilevers using different materials, methodology and design so that these can be used in diverse micro-systems. Generally, cantilever
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