Study of the Structure, Electrical Conductivity of Cr-Cu Thin-Film Composition on a Glass Substrate
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MRS Advances © 2019 Materials Research Society DOI: 10.1557/adv.2019.243
Study of the Structure, Electrical Conductivity of Cr-Cu Thin-Film Composition on a Glass Substrate Sergey M. Karabanov Ryazan State Radio Engineering University, 59/1 Gagarina St., Ryazan 390005, Russia
ABSTRACT Cu films are widely used in electronics for interconnections. In some applications, reliable thin-film connecting elements having high electrical conductivity, mechanical stability and adhesion to a glass substrate are required. In this case the length of the elements amounts to tens of centimetres. In this paper, Cu was used as the basis for the connecting elements. To ensure high adhesion Cr was used as an underlayer. The paper investigates the structure, electrical conductivity, adhesion, defect formation of Cu, Cu-Cr, Cr-Cu-Cr thin-film conductors. As a result of the performed research, the regularities of changes of the film structure, electrical conductivity, adhesion, defect formation depending on the technological process parameters were established. Physical and technological mechanisms determining the observed patterns are considered. The research results are used in the device production technology.
INTRODUCTION Thin metal films are widely used in various areas of electronics, instrument making, etc. [1, 2]. Aluminium, Ti-Pd-Au, Ti-Pt-Au and other structures are used as the material for films [3, 4]. A number of devices require thin metal films applied on large surfaces (up to 1 m2), and the ratio of the film length to its width can be from 100 to 1000. In this case, strict requirements for electrical conductivity, adhesion, and imperfection are imposed to the film characteristics. In some cases Au and Ag based thin films are used. The use of platinum group metals increases the cost of devices. In [3], thin films based on Cr-Cu-Cr, Cr-Cu-Ni are used. In this case glass is used for substrates. Glass consists of an oxide mixture: SiO2, Na2O, CaO, etc. [5]. Water may be actively adsorbed on the surface of glass containing Na2O that may result in decrease of the film adhesion and the defect growth in films [4]. The paper studies the structure, electrophysical properties (electrical conductivity, adhesion) and defect formation in thin Cr-Cu-Cr films on a glass substrate. Cr provides
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good adhesion to the glass substrate surface and protects the Cu film from environmental influence. Cu provides high electrical conductivity of the film. RESEARCH PROCEDURE High-purity Cu and Cr were used for the film deposition. Cr and Cu films were deposited by vacuum evaporation at a pressure of 10 –7 mm Hg. For the deposition of Cu a molybdenum evaporator was used, and for the Cr deposition a tungsten evaporator was used. Glass on the basis of SiO2 (73%), Na2O (13%), CaO (8.5%) and other oxides was used as a subst
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