Wireless and RF Module Packaging using Low Loss Ceramic and Low Loss Organic Materials
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Wireless and RF Module Packaging using Low Loss Ceramic and Low Loss Organic Materials James J. Logothetis,1 Daniel I. Amey and Timothy P. Mobley2 1.
Merrimac Industries Inc. West Caldwell, NJ DuPont Microcircuit Materials Research Triangle Park, NC
2.
Abstract This presentation describes the basics of Multi-Mix and Green Tape™ Low Temperature Cofired Ceramic (LTCC) technologies. The design and performance of a 28 GHz mixer package using a GaAs MMIC and the 943 Green Tape™ LTCC system with embedded capacitance technology is described including the tradeoffs, advantages and compatibility of Multi-Mix and Green Tape™ technologies. A design approach combining the technologies offers the designer new options to meet the ever-increasing demands of high frequency packaging. Introduction High speed digital and high frequency wireless applications are resulting in the emergence of new interconnecting substrate and package materials to meet the demand for higher density, lower power, improved thermal conductivity, stable physical properties, environmental friendliness and lower cost. However, it can be difficult for any one material system to meet all of these demands. Both organic printed wiring and ceramic material solutions offer high-density packaging and interconnection with stable dimensional and electrical properties over a broad frequency range. Integrated passive components and functions in ceramic are in volume production today for wireless/RF and high-speed digital applications. Multi-Mix is an organic technology based on etched copper conductors and PTFE composite dielectric layers that are fusion bonded to form homogeneous multilayer structures. The bonded layers can incorporate, etched metal film resistors, passive circuit elements, and embedded semiconductor devices as well as LTCC modules. Multilayer, microwave integrated modules formed using this technology can be as small as 0.2 inches square, and multifunction modules as large as 16 x 22 inches. Green Tape™ LTCC (Low Temperature Cofired Ceramic) is a system consisting of glass ceramic dielectric compositions in a tape format and high conductivity via and conductor metalizations. Passive functions can be embedded using high k dielectric pastes or tape as well as co-fired resistors and inductors. LTCC modules or packages provide a hermetic multilayer interconnection structure with very uniform and stable frequency and temperature dependent properties. A design approach using these technologies offers the designer new options to meet the demands of high frequency packaging.
Multi-Mix® Technology Multi-Mix® is an organic technology for the interconnection and packaging of microwave circuits based on etched copper conductors, plated copper interconnections and PTFE/ceramic/glass composite dielectric layers, which are fusion bonded to form homogeneous multilayer structures. The bonded layers may incorporate passive stripline elements (couplers, filters, dividers), embedded passives (resistors, capacitors, inductors), thick metal heat-sink layers, p
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