A modelling and simulation approach for radio frequency (RF) parasitic effects reduction in wafer-level packaging (WLP)
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TECHNICAL PAPER
A modelling and simulation approach for radio frequency (RF) parasitic effects reduction in wafer-level packaging (WLP) of RF-MEMS passive components J. Iannacci1 Received: 17 March 2020 / Accepted: 7 May 2020 Ó Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract RF-MEMS, i.e. micro electro mechanical-systems (MEMS) for radio frequency (RF) passive components, started to make their way into mass-market applications in the telecommunication segment. One critical aspect to ensure easy employment of such devices within systems and sub-systems is that of packaging and encapsulation. In packaging of RF-MEMS, next to the protection of the fragile movable structures and membranes, optimisation of the package electrical performance plays a very important role. In this work, a wafer-level packaging process is investigated and optimised in order to minimise its electrical parasitic effects. The capping silicon substrate resistivity, the substrate thickness and the geometry of throughsilicon vias are optimised relying on finite element method electromagnetic simulations. Moreover, a preliminary analysis on the electromagnetic effects of the wafer-to-wafer bonding techniques (i.e. solder bump reflow and Isotropic or anisotropic conductive adhesive – ICA/ACA) is presented.
1 Introduction Micro electro mechanical-systems (MEMS) based radio frequency (RF) passive components, broadly known as RFMEMS, started since a few years to be employed in the mass-market segment of 4G-LTE smartphones and mobile terminals (Allan 2013; Chakraborty et al. 2014). Despite such an achievement represents a significant goal, after about two decades of research, development and discussion of RF-MEMS across the scientific community, the actual potential of such a technology has still to display. In fact, the upcoming scenario of 5G, i.e. the 5th generation of mobile communications, seems to be the ideal field of application posing needs and requirements that RF passives realised in MEMS technology are able to address (Iannacci 2018, 2020). From the point of view of RF-MEMS ease of employment in market applications, given the non-standardisation of Microsystem technologies themselves, encapsulation and integration of RF passives based on MEMS is certainly & J. Iannacci [email protected] 1
Center for Materials and Microsystems (CMM), Fondazione Bruno Kessler (FBK), Via Sommarive, 18, 38123 Trento, Italy
a critical aspect (Seok 2013). Packaging of RF-MEMS is an articulated task from different points of view. First, it has to provide appropriate protection of the movable and fragile thin membranes from any harmful factors, like mechanical shocks, contamination particles, moisture, and so on. Simultaneously, the added packaging structures are required to affect to the least extent possible the RF behaviour of MEMS devices. In addition, the package should also facilitate the heterogeneous integration of Microsystems technologies with standard semiconductor devices (e.g. CMOS). Giv
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