RF and Microwave Microelectronics Packaging II
Reviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and
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and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Ken Kuang • Rick Sturdivant Editors
RF and Microwave Microelectronics Packaging II
Editors Ken Kuang Torrey Hills Technologies, LLC San Diego, CA, USA
Rick Sturdivant Azusa Pacific University Azusa, California, USA
ISBN 978-3-319-51696-7 ISBN 978-3-319-51697-4 (eBook) DOI 10.1007/978-3-319-51697-4 Library of Congress Control Number: 2009939146 © Springer International Publishing AG 2017 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publisher remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. Printed on acid-free paper This Springer imprint is published by Springer Nature The registered company is Springer International Publishing AG The registered company address is: Gewerbestrasse 11, 6330 Cham, Switzerland
From Ken Kuang: To my family, Zheng, Simon and Andrew, you are my inspiration and support. From Rick Sturdivant: Dedicated to my parents, Jim and Linda Sturdivant.
Foreword
The question how to package an electronic component has become a key issue in RF system development. In many cases it decides about the "to be, or not to be". In the end, it is a combination of electrical, thermal and mechanical properties as well as fabrication cost which makes the difference. All these aspects need to be taken into account and this multi-disciplinary approach distinguishes packaging development from classical circuit design. Moreover, when packaging modules in the microwave and mm-wave range, there is no general solution which could be used as a standard overall. The best choice varies depending on frequency range, application, volume and cost limitations, just to name some of the most important boundary conditions. While in the low GHz range the situation is relatively mature and high-volume lowcost approaches are in routine use for the mobile communications market, in the mm-wave frequency range above 100 GHz the la
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