RF and Microwave Microelectronics Packaging
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers
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Ken Kuang · Franklin Kim · Sean S. Cahill Editors
RF and Microwave Microelectronics Packaging
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Editors Ken Kuang Torrey Hills Technologies, LLC 6370 Lusk Blvd, F-111 San Diego CA 92121 USA [email protected]
Franklin Kim Kyocera America, Inc. 8611 Balboa Avenue San Diego CA 92123 USA [email protected]
Sean S. Cahill BridgeWave Communications Inc. 3350 Thomas Road Santa Clara CA 95054 USA [email protected]
ISBN 978-1-4419-0983-1 e-ISBN 978-1-4419-0984-8 DOI 10.1007/978-1-4419-0984-8 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009939146 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Preface
This book is an outgrowth of the first IMAPS (International Microelectronics and Packaging Society) Advanced Technology Workshop on RF/Microwave Packaging, held September 16–18, 2008 in San Diego, California. Wireless technologies have undergone tremendous growth in the last decade and the interest in packaging for high-frequency applications has grown as well. Over 30 invited speakers gave presentations on select advanced topics in RF, microwave, millimeter-wave and broadband packaging. The motivation behind this conference, however, goes beyond the obvious areas of utility. When referring to fundamental engineering limits to very high speed electronics, packaging and interconnect constraints figure significantly. Ever increasing data rates are transforming digital technologies into what are essentially RF systems. The once arcane tools of the RF discipline are becoming increasingly applicable to electronic systems in general, motivating many new considerations. RF systems, despite their small device count, have traditionally been voracious, inefficient consumers of power, creating significant challenges for packaging engineers to deal with heat dissipation. Most digital devices have been much more frugal, but speed and high levels of integration turn these devices into significant heat sources as well. In light of these evolutionary trends, a sampling of the workshop participants were asked to submit chapters on these fascinating areas of development for the work at hand. Given the diversity of voices at this workshop, and the highly interdisciplinary
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