A Universal CMP Process Description Language for Standardization
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A Universal CMP Process Description Language for Standardization Takafumi Yoshida YNT-jp.Com 2-10-17 Asae, Hikari, Yamaguchi 743-0021, Japan ABSTRACT This paper proposes a universal Chemical Mechanical Planarization (CMP) process description language. We discuss the appropriate attributes needed to describe complex CMP processes and the capability for the standardization of CMP. We show an implementation of the language based on an open standard. INTRODUCTION The complexities of the CMP process are due to the large set of explicit and implicit process parameters and the rapid growth in its various applications. The complexities are often subject to users’ frustrations when users maintain the process parameters for their many different products/tools, compare newly proposed processes by semiconductor solution providers, and try to use foundries. One of the key solutions to mitigate these difficulties is in the use of both a universal process description language and universal standards. We have recognized the importance of the process description language through our development of a script language for CMP simulation products. The process description language should be simple for writing and reading, flexible to the constant increase of process parameters, and malleable to on-line use, such as recipe management, statistical process control and database processing. To satisfy the requirements above, a simple structure based on an open standard format is essential. We propose a universal CMP process description language using the Extensible Markup Language (XML). We expect this description language will help to break through the ITRS red bricks ahead of us (figure 1) [1-5]. In this paper, firstly we explain seven elements to describe the CMP process. Secondly, we introduce a skeleton of the process description language using XML. Thirdly, we show the examples of the implementation. Finally, we discuss the role of a universal process description language for building a body of knowledge toward standardization of the CMP. Preston & MRR Equations Contact & Fluid Mechanics Chemistry & Physics Chemical Mechanical Polishing
SCIENCE
PRODUCTION
Glass / Lens Polishing
CMP Body of Knowledge CMP Standards PROFESSIONAL ENGINEERING
COMMERCIALIZATION CRAFT
Process Description Language
Silicon Wafer
Design for Manufacturability Nanotechnology
CMP for Microelectronics CMP Tools & Consumables
Figure 1. Progress toward Professionalism in CMP [3]
ITRS
Moore's Law Gilder's Law Metcalfe's Law Shugart's Law
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REQUIRED MINIMUM ELEMENTS We choose five requisite elements and two optional elements to effectively describe the CMP process as shown in table 1. We explain these elements briefly here. “Process Name” is the name that is given to the instance of a base structure specified by “Process Mode” to describe a concrete CMP process. “Process Name” should be unique to the process when it has different parameter values even if the structure is the same. “Process Mode” is an element that represents the base class for
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