Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Advanced Nanoscale ULSI Interconnects: Fundamental and Applications brings a comprehensive description of copper based interconnect technology for Ultra Large Scale Integration (ULSI) technology to Integrated Circuit (ICs) application. This book reviews t
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Advanced Nanoscale ULSI Interconnects
Fundamentals and Applications
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
Yosi Shacham-Diamand · Tetsuya Osaka · Madhav Datta · Takayuki Ohba Editors
Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications
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Editors Yosi Shacham-Diamand Tel Aviv University 69978 Ramat Aviv, Tel Aviv Israel [email protected]
Madhav Datta Cooligy, Inc. 2370 Charleston Road Mountain View CA 94043 USA [email protected]
Tetsuya Osaka Department of Applied Chemistry Waseda University 3-4-1 Okubo Tokyo Shinjuku-ku 169-8555 Japan [email protected] Takayuki Ohba Division of Corporate Relations The University of Tokyo 7-3-1 Hongo Tokyo Bunkyo-ku 113-8654 Japan [email protected]
ISBN 978-0-387-95867-5 e-ISBN 978-0-387-95868-2 DOI 10.1007/978-0-387-95868-2 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009934298 © Springer Science+Business Media, LLC 2009 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
This book is dedicated to my wife Anat for all her support and patience.
Preface
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-largescale integration (ULSI) technology for integrated circuit (IC) application. Integrated circuit technology is the base for all modern electronics systems. You can find electronics systems today everywhere: from toys and home appliances to airplanes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the field of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e.g., speed, number of devices, chip area) improve exponentially as a function of time. For example, the number of components per chip doubles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid g
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