Advances in Chemical-Mechanical Planarization
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Advances in
Chemical– Mechanical Planarization
Rajiv K. Singh and Rajeev Bajaj, Guest Editors Abstract The primary aim of this issue of MRS Bulletin is to present an overview of the materials issues in chemical–mechanical planarization (CMP), also known as chemical–mechanial polishing, a process that is used in the semiconductor industry to isolate and connect individual transistors on a chip. The CMP process has been the fastest-growing semiconductor operation in the last decade, and its future growth is being fueled by the introduction of copper-based interconnects in advanced microprocessors and other devices. Articles in this issue range from providing a fundamental understanding of the CMP process to the latest advancements in the field. Topics covered in these articles include an overview of CMP, fundamental principles of slurry design, understanding wafer–pad–slurry interactions, process integration issues, the formulation of abrasivefree slurries for copper polishing, understanding surface topography issues in shallow trench isolation, and emerging applications. Keywords: chemical–mechanical planarization, chemical–mechanical polishing, CMP, copper interconnects, low- dielectrics, nanotopography, shallow trench isolation, silica polishing, slurry design.
Introduction In the past decade, chemical–mechanical planarization (CMP), also known as chemical–mechanical polishing, has emerged as the fastest-growing operation in the semiconductor manufacturing industry, and it is expected to show equally explosive growth in the future.1 It is estimated that more than 150 million planarization operations will be conducted this year, and that number is expected to double within the next three years.2 This rapid increase will be fueled by the introduction of copper-based interconnects for logic and other devices.3 Other novel applications of CMP for next-generation nanoscale devices are rapidly emerging. The market size for CMP equipment and consumables (slurries, pads, etc.) grew from $250 million in 1996 to over $1 billion in 2000.4 The consumables market, especially in the area of slurries, is quite robust and is expected to increase from the MRS BULLETIN/OCTOBER 2002
present level of $250 million to more than $800 million within the next five years.3 The slurries, which typically contain particle-based abrasives and chemical additives, represent the largest value-added application of nanoparticles—a key area of nanotechnology that is currently garnering substantial funding from governmental organizations and private corporations. It has been estimated that CMP nanoparticles alone will constitute nearly 60% of the total $1 billion worldwide market for nanopowders by 2005. One of the unique aspects of CMP is that the process was invented, developed, and put into application by the industry itself without any significant interaction with academic institutions. Consequently, the whole process is shrouded in secrecy, with most of the literature available in the form of patents. The composition of the slurry is the mo
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