An Improved In-line Inkjet Printing Process for 3D Multilayer Passive Devices
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An Improved In-line Inkjet Printing Process for 3D Multilayer Passive Devices
A. Yakoub1, M. Saadaoui1, R. Cauchois1, 2, J-M. Li1, P. Benaben1 1 Ecole Nationale Supérieure des Mines de St-Etienne, Centre de Microélectronique de Provence, 13120 Gardanne, France. 2 Gemalto, department of Innovation & Manufacturing Technologies, 13420, Gemenos, France. ABSTRACT This paper describes an in-line process for the realization of 3D electronic components on A4 format substrate by piezo inkjet printing. This process is developed within a semi-industrial prototype system named “JETPAC”. JETPAC includes an oxygen plasma torch for surface preparation and post-process modules as a variable frequency microwave oven and an UV lamp for metal selective sintering and dielectric ink curing, respectively. JETPAC is used to achieve passive components by chaining conductor and dielectric layers on kapton® substrate: silver nanoparticles based ink is used to print conductors. For multilayer component elaboration, the ® metal ink is deposited both on kapton and on printed dielectric materials. Due to a low surface energy (S.E) of the printed dielectric, the realization of efficient silver tracks is compromised. A special process combines O2 plasma treatment and UV exposure before printing, allowing the reaching of S.E. value on dielectric near the optimum one (55mN/m). This pre-process allows printing of well-defined conductive structures on top of the dielectric. In-line sintering of printed structures is then performed using variable frequency microwave source. The process allows the elaboration of multilayer structures including stacked resistors and capacitors. These results make the developed process very promising for the realization by inkjet printing of passive devices for smart tag applications. INTRODUCTION Printed electronic devices are rapidly increasing worldwide. Traditional printing technics used for producing thin films for electronic circuits are contact methods and usually need a hard mask to get well-defined structures thus producing a lot of wastes. Inkjet printing is a selective non-contact technology described as a very promising key target to reduce costs and lead time for the next generation of printed electronics. By controlling the volume and the localization of printed dots, a full additive manufacturing of devices is targeted on large area and flexible substrates without waste. Simultaneous printing of multilayer materials is innovative and enables the development and the production of different electronic devices like RFID, OTFT, OLED, OPV, etc. [1]. However, one of relevant challenges in inkjet printing technology is the control of the interfacial phenomena between deposited layers because of the variation of surface conditions of each deposited material [2] [3]. Thus, several steps of manufacturing with a pre and post treatment operations are mostly required.
We focus in this study on the demonstration of the feasibility with an in-line process of multilayer electronic passive devices such as resistors and c
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