Characteristics of Cu Film Deposited Using VLPPS
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N. Zhang, F. Sun, L. Zhu, C. Verdy, M.P. Planche, H. Liao, C. Dong, and C. Coddet (Submitted May 4, 2010; in revised form June 29, 2010) Cu coatings were obtained by the very low pressure plasma spray (VLPPS) process using a torch F4-VB. The tank pressure was varied from 1 to 5 mbar: these specific conditions can be allowed to obtain a higher vapor condensation fraction in the coating. Different sizes of powders are used to compare the vaporization level. The other possible influencing factors for obtaining compact film-like coating are also considered such as the distance between the torch and substrate, the orientation of the vapors and also the substrate temperatures. Microstructures of coatings are analyzed and combined with the results of plasma diagnostics. Jobin-Yvon spectrometer (type TRIAX190, UK) and Plasus Specline Spectroscopy software are both used for detecting and analyzing plasma spectrum data. The value of plasma electronic excited temperature Te was calculated through choosing Ha and Hb two atom spectra. The results showed that the plasma belongs to cold plasma in the local thermodynamic equilibrium situation in VLPPS.
Keywords
VLPPS, Cu, Film, Spectral diagnostic, Electronic temperature
1. Introduction The very low pressure plasma spray (VLPPS) process has been developed with the aim of depositing uniform and thin coatings with large area coverage by plasma spraying. This can be used in applications where large areas cannot be covered by the PVD process or require expensive processing costs, and where traditional thermal spray coatings have reached their limits based on porosity and thickness requirements (Ref 1-4). For example, in atmospheric plasma spraying (APS), the problems which usually occur are multi-imperfections such as easily oxidized and relatively low adhesive strength for thick coatings (Ref 5). A lot of work on the research and application of LPPS have been carried out with ceramic materials
This article is an invited paper selected from presentations at the 2010 International Thermal Spray Conference and has been expanded from the original presentation. It is simultaneously published in Thermal Spray: Global Solutions for Future Applications, Proceedings of the 2010 International Thermal Spray Conference, Singapore, May 3-5, 2010, Basil R. Marple, Arvind Agarwal, Margaret M. Hyland, Yuk-Chiu Lau, Chang-Jiu Li, Rogerio S. Lima, and Ghislain Montavon, Ed., ASM International, Materials Park, OH, 2011. N. Zhang, Key Laboratory of Materials Modification, Dalian University of Technology, 116085 Dalian, China and LERMPSUTBM Site de Se´venans, 90010 Belfort Cedex, France; F. Sun, L. Zhu, C. Verdy, M.P. Planche, H. Liao, and C. Coddet, LERMPS-UTBM Site de Se´venans, 90010 Belfort Cedex, France; and C. Dong, Key Laboratory of Materials Modification, Dalian University of Technology, 116085 Dalian, China. Contact e-mail: [email protected].
Journal of Thermal Spray Technology
(Ref 4, 6-10). Nowadays, this type of research has also been combined with optical emission spectroscopy (OES) a
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