Evaluation and Testing of Organometallic Precursor for Copper Direct-Write
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1002-N07-23
Evaluation and Testing of Organometallic Precursor for Copper Direct-Write Prodyut Majumder1, Manish Tiwari2, Constantine Megaridis2, James McAndrew3, Mindi Xu3, John Belot4, and Christos G Takoudis1,5 1 Department of Chemical Engineering, University of Illinois at Chicago, 810 S Clinton St, Chicago, IL, 60607 2 Department of Mechanical and Industrial Engineering, University of Illinois at Chicago, 842 W Taylor Street, Chicago, IL, 60607 3 American Air Liquide, 200 GBC Drive, Newark, DE, 19702 4 Department of Chemistry, University of Nebraska, 516 Hamilton Hall, Lincoln, NE, 68588 5 Department of Bioengineering, University of Illinois at Chicago, 851 S Morgan St, Chicago, IL, 60607 ABSTRACT A capillary bridge printing technique has been used to deposit copper interconnects using homogeneous solutions of a Cu(II) precursor in a series of low boiling primary alcohols. The rheological properties of the solutions have been measured first to determine their printability. The as-printed lines with subsequent annealing at relatively low temperatures (~200 ∞C), in order to evaporate the volatile solvents and facilitate dissociation of the precursor deposit, produced conducting interconnects. The precursor has been demonstrated to be self-reducing and requires no reducing environment (e.g. H2) thus making the interconnect formation easier. Moreover, successful decomposition of the precursor into metallic Cu at such low temperatures holds promise for applications involving flexible polymer substrates. INTRODUCTION Fabrication of metallic conducting tracks or interconnects on a range of substrates with different surface energies and flexibility is an inherent part of both micro and macro-electronic circuits. Currently, lithography is used effectively to fabricate electronic circuits with nm scale resolution. But there exist many electrical applications that require low resolution lines (> 50 µm) such as solar cells, capacitors, printed circuit boards, and microelectronic packaging. For such applications, photolithography is not only expensive but also time consuming process as it involves numerous fabrication steps including high-vacuum processes like plasma etching, etc. In addition, being subtractive in nature, photolithography produces unwanted chemical waste. Thus photolithography is not an optimal technique for fabricating low resolution lines. Direct metal printing involves material deposition only at the desired location and thus can serve as an attractive alternative to conventional photolithographic processing of circuit fabrication when precision is not of essence. Direct printing is an additive fabrication process, unlike photolithography, therefore requires minimal chemical waste handling and disposal cost. It is very cost effective and has high throughput with low material loss. Above all, direct printing is an environment friendly technique of circuit fabrication. There exist many direct metal printing techniques such as spray printing [1-3], screen printing [4], and ink-jet printing [2, 5-11] which
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