Inkjet Printed Spiral Stretchable Electronics Using Reactive Ink Chemistries
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Inkjet Printed Spiral Stretchable Electronics Using Reactive Ink Chemistries
Avinash Mamidanna1, Zeming Song1, Cheng Lv1, Christopher S. Lefky1, Hanqing Jiang1, Owen Hildreth1 1 Arizona State University, Tempe, Arizona, United States ABSTRACT Fabrication methods and performance characteristics of spiral stretchable interconnects fabricated using drop-on-demand printing of silver reactive inks are discussed. This work details ink optimization, device fabrication, and device characterization while demonstrating the potential applications for reactive inks and new design strategies in stretchable electronics. Devices were printed with an ethanol stabilized silver diamine reactive ink and cycled to 160 % over 100 cycles with less than 10% increase in electrical resistance. Maximum deformation before failure was measured at 180% elongation. A novel method for fabrication of a stretchable electronics device has been studied and verified.
INTRODUCTION System-on-a-Chip (SOC) or Lab-on-a-chip (LOC) approaches, where multiple functionalities are combined into a single chip are the future of microelectronics[1]. However, for bio-medical applications, most of the devices require the electronics to be spread over a large are rather than being integrated on a single chip[2]. This can prove to be challenging since spanning large distances while maintaining robust electrical contact is difficult[5,6]. A few other devices, such as flexible display panels[7], health sensors or on-body human sensors[3] require components that need to be connected by flexible and elastically deformable electrical interconnects thereby ensuring that the devices can conform to their intended surfaces[4]. This work details a set of processes and chemistries to connect separate chips, or “islands,” by printing free-standing stretchable interconnects[5]. Here, ink optimization, device fabrication, and device characterization are done using a low-temperature, self-reducing Ag ink or reactive ink to print high-quality silver interconnects. Unlike traditional particle-based inks that effectively print clusters of loosely connected particles, reactive inks print chemical reactions that, if properly designed, produce a high-quality material with excellent material properties[8,19,10]. This work thus demonstrates that island interconnects can be readily fabricated at low cost and efforts using a combination of drop-on-demand printing and reactive inks. THEORY The purpose of this approach is to connect hard components via stretchable metal interconnects for easier design and fabrication of electronic components. Using the drop-ondemand printing technique in combination with reactive inks formulated by Lewis’ group,
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flexible interconnects are readily fabricated without the use of conventional lithography techniques where integrati
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