Laser Direct-Write of Materials for Microelectronics Applications
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99 Mat. Res. Soc. Symp. Proc. Vol. 624 ©2000 Materials Research Society
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Pulsed substrate. Moving the beam or Lase Dielectric substrate between laser pulses permits Battery patterning of the deposited material. Sensor The lateral dimensions of the deposited material can be as small as the laser spot size, typically of the Substrates Pastic order of tens of microns. The main challenges in this Cofmposite process are: (a) high-definition Conlormal & 3-D transfer of the material from the A91 rribbon to the substrate, (b) densification and acceptable Figure 1. The basic idea of direct-write deposition process. properties of the deposited material, Laser pulse energy absorbed by the material layer causes rapid and (c) effective adhesion of the vaporization and subsequent propulsion across a small gap transferred material to the substrate. toward the receiving substrate. If the gap is kept sufficiently small, the size and shape of the deposited material is defined by Post-deposition sintering may be the laser spot size. A host of electronic materials can be necessary in order to achieve proper transferred onto many different substrates. densification, because, the electrical properties of transferred features are function of their morphological details. This ability to produce direct-write electronic components on flexible substrates, presents a path to fabrication of mesoscale conformal electronic devices [4]. An attractive advantage of the direct-write machine currently under development is that it integrates several functions on one platform: patterned deposition, in-situ sintering and/or annealing, and in-situ micromachining and surface treatment. The direct-write machine takes advantage of the established techniques of laser machining to produce microelectronics components significantly smaller than those achievable with standard screen-printing techniques. However, resolution of the direct-write features is also dependent on the rheological properties of
the material layers on the ribbon, therefore, a better understanding of materials rheology and its
tailoring for direct-write process is required. Incorporation of precise motion control and a dynamic transfer scheme enable the directwrite technique to write patterns at a higher rate, currently about 200 mm/s (for line dimension approximately 60 prm wide and 8 jtm thick). The combination of high speed and high resolution makes the direct-write technique an attractive technology for production of microelectronic components such as resistors, capacitors, inductors, conducting lines, sensors, and antennas. Another advantage of this method is its flexibility of using many different materials for pattern generation. The basic transfer mechanisms for most material/matrix systems are similar. Deposited material properties are strongly influenced by formulation chemistry, rheology and post-deposition processing. In addition to rheology and chemistry, other essential aspects include choice of an appropriate matrix, shelf-life, and compatibility with
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