Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it a

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Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging

Kim S. Siow Editor

Die-Attach Materials for High Temperature Applications in Microelectronics Packaging Materials, Processes, Equipment, and Reliability

Editor Kim S. Siow Institute of Microengineering and Nanoelectronics Universiti Kebangsaan Malaysia Bangi Selangor, Malaysia

ISBN 978-3-319-99255-6 ISBN 978-3-319-99256-3 https://doi.org/10.1007/978-3-319-99256-3

(eBook)

Library of Congress Control Number: 2018958713 © Springer Nature Switzerland AG 2019 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors, and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publisher remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. This Springer imprint is published by the registered company Springer Nature Switzerland AG The registered company address is: Gewerbestrasse 11, 6330 Cham, Switzerland

“This timely and well-written/edited book is a great reference for those researchers and practitioners engaging in high-temperature Pb-free die attach materials. It is highly recommended.” – Simon S. Ang, Professor and Director of High Density Electronics Center, University of Arkansas, USA “Rich and detailed analysis of high temperature die attach materials especially sintered silver joint.” – Erich Kainhofer, Manager Techsupport Singapore, Besi Singapore “For those working in high temperature die attach materials, this book is a timely arrival to address the Pb-free issues. Read this welledited book to find out more from the different thought-leaders.” – Hu Anming, University of Tennessee, Knoxville

“It was yet time to put some order among the sintering die attach available information, and this book definitely does.” – Francesc Masana, Barcelona Semiconductors S.L.U. “We must be thankful to Kim for bringing a group of thought-leaders in this collection of high temperature

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