Metal deposition on flexible membrane through the combination of localized electrochemical deposition and electroless pl
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TECHNICAL PAPER
Metal deposition on flexible membrane through the combination of localized electrochemical deposition and electroless plating Meng-Chi Huang • Tein-Li Chang • Tune-Hune Kao • Chien-Chung Fu
Received: 2 February 2012 / Accepted: 18 October 2012 / Published online: 21 December 2012 Ó Springer-Verlag Berlin Heidelberg 2012
Abstract In this paper, we combined localized electrochemical deposition and electroless plating process for fabricating the metal pattern with the large area on flexible membrane. The pattern of the anode plate can rapidly transfer to the cathode membrane by localized electrochemical deposition. The thickness of the pattern can be increased by electroless plating process. The width of the mask pattern was close to the width of the final pattern. The anode plate can be used over fifty times for this process until the pattern was electrolyzed completely. This method provides a possible low cost approach to fabricate high metal structures on the flexible substrate with large area. It may have the potential to be applied in the fabrication of e-paper, flexible printed circuit and eventually adapted to roll-to-roll process.
M.-C. Huang C.-C. Fu Institute of Nano Engineering and Microsystems, National Tsing-Hua University, Hsinchu, Taiwan, ROC T.-L. Chang Department of Mechatronic Technology, National Taiwan Normal University, Taipei, Taiwan, ROC T.-H. Kao Mechanical and Systems Research Laboratories, Industrial Technology Research Institute, Hsinchu, Taiwan, ROC C.-C. Fu (&) Department of Power Mechanical Engineering, National Tsing-Hua University, Hsinchu, Taiwan, ROC e-mail: [email protected]
1 Introduction In recent years, micro fabrication technology is commonly used in the electronics industry, including microphone, printed circuit, inkjet print head and so on. Generally, the fabrication process is used to forming functional microstructures on Si or glass substrates. It can control the shape and the resolution of precision patterns with two-dimensional planar features through mask and lithography. High structures or even three-dimensional microstructures can be fabricated by using multiple lithography steps, layer by layer, either to build-up photo resist in layers or to remove material systematically for forming the required profile. Electroplating process is usually subsequently applied to transfer the high structure pattern to metal. However, most of these processes have to be done on hard substrates such as Si, glass or metal plates. The aim of our study is to develop a low cost method to fabricate high metal structures on the flexible substrate with large area possibility. In Bard et al. (1989) reported a new type of scanning probe microscopy, which is called scanning electrochemical microscope (SECM). It is a scanning probe technique with high spatial resolution to obtain the information from the chemical-surface samples. SECM was then used for performing the electrochemical measurements and modification of surfaces by depositing or etching of metals and semiconductors.
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