A review: development of the maskless localized electrochemical deposition technology
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ORIGINAL ARTICLE
A review: development of the maskless localized electrochemical deposition technology Jinkai Xu 1 & Wanfei Ren 1 & Zhongxu Lian 1 & Peng Yu 1 & Huadong Yu 1 Received: 23 November 2019 / Accepted: 17 July 2020 # Springer-Verlag London Ltd., part of Springer Nature 2020
Abstract Presented in 1996, maskless localized electrochemical deposition (LECD) is an emerging and unconventional manufacturing technology that originated from precision electroforming and electroplating. As a novel additive manufacturing technology, it forms a three-dimensional structure layer by layer at atomic scale. In this work, we present a review of the theoretical basis and key parameters of maskless LECD technology. LECD process, almost limited to linear structure-based depositions, is capable of creating structures with high aspect ratio up to 280. However, the degree of deposition accuracy is not satisfactory during the whole process. Besides, the deposition rate is rather slow and the highest deposition rate of 25 μm/s was reported in published literature. Moreover, not all metals can be deposited due to the limitations of the electrochemical discipline. For instance, the effects of interelectrode potential difference, interelectrode gap, scanning speed, electrolyte concentration, and energy field on the quality of maskless LECD were discussed. Although all parameters abovementioned have an effect on the deposition results, there is currently no optimization software that can calculate the optimal values in an effective manner. By combining different deposition structures, special tiny part systems can be generated or integrated into devices for tackling current and future challenges in some fields such as electronic circuits, microfluidics, communications, and biomedical aspect. Additionally, this work also introduces main hybrid variants of LECD. Possible future efforts to fully exploit LECD potential are also discussed. Keywords Electrochemical . Localized deposition . Additive manufacturing . Micrometal 3D structures . 3D printing
1 Introduction As microcomponents are widely used in high-tech fields, the method of manufacturing tiny parts has also changed dramatically [1]. In recent years, the method of additive manufacturing (AM) tiny parts has been greatly developed due to its
* Jinkai Xu [email protected] * Huadong Yu [email protected] Wanfei Ren [email protected] Zhongxu Lian [email protected] Peng Yu [email protected] 1
Ministry of Education Key Laboratory for Cross-Scale Micro and Nano Manufacturing, Changchun University of Science and Technology, Changchun 130022, China
advantages of low material consumption, environmental protection, and design convenience. As one kind of AM methods, LECD [2] is capable of printing microcomponents or structures directly at an atom scale in a certain position as designed without any mask or support material, or any extra thermal energy resource and as a result no thermal residual stress is produced during the deposition process. Furthermore, neither strict
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