Nanomechanical Properties of Solid Surfaces and Thin Films
Instrumentation for the testing of mechanical properties on the submicron scale has developed enormously in recent years. This has enabled the mechanical behavior of surfaces, thin films, and coatings to be studied with unprecedented accuracy. In this cha
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Nanomechani 22.1 Instrumentation ................................... 22.1.1 AFM and Scanning Probe Microscopy .................................. 22.1.2 Nanoindentation ......................... 22.1.3 Adaptations of Nanoindentation .... 22.1.4 Complimentary Techniques............ 22.1.5 Bulge Tests .................................. 22.1.6 Acoustic Methods ......................... 22.1.7 Imaging Methods .........................
688 688 689 690 691 691 692 693
22.2 Data Analysis ....................................... 22.2.1 Elastic Contacts ............................ 22.2.2 Indentation of Ideal Plastic Materials..................................... 22.2.3 Adhesive Contacts ........................ 22.2.4 Indenter Geometry ....................... 22.2.5 Analyzing Load/Displacement Curves......................................... 22.2.6 Modifications to the Analysis ......... 22.2.7 Alternative Methods of Analysis ..... 22.2.8 Measuring Contact Stiffness ........... 22.2.9 Measuring Viscoelasticity...............
696 699 700 701 702
22.3 Modes of Deformation .......................... 22.3.1 Defect Nucleation ......................... 22.3.2 Variations with Depth ................... 22.3.3 Anisotropic Materials .................... 22.3.4 Fracture and Delamination............ 22.3.5 Phase Transformations..................
702 702 704 704 704 705
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22.4 Thin Films and Multilayers .................... 707 22.4.1 Thin Films ................................... 707 22.4.2 Multilayers .................................. 709 22.5 Developing Areas .................................. 711 References .................................................. 712
of polymers and biological materials. The importance of using a range of complementary methods such as electron microscopy, in situ AFM imaging, acoustic monitoring, and electrical contact measurements is emphasized. These are especially important on the nanoscale because so many different physical and chemical processes can affect the measured mechanical properties.
Part C 22
Instrumentation for the testing of mechanical properties on the submicron scale has developed enormously in recent years. This has enabled the mechanical behavior of surfaces, thin films, and coatings to be studied with unprecedented accuracy. In this chapter, the various techniques available for studying nanomechanical properties are reviewed with particular emphasis on nanoindentation. The standard methods for analyzing the raw data obtained using these techniques are described, along with the main sources of error. These include residual stresses, environmental effects, elastic anisotropy, and substrate effects. The methods that have been developed for extracting thin-film mechanical properties from the often convoluted mix of film and substrate properties measured by nanoindentation are discussed. Interpreting the data is frequently difficult, as residual stresses can modify the contact geometry and, hence, invalidate the standard analysis routines. Work hardening in the d
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