Optimized FE Model for System-Level Solder Joint Reliability Analysis of a Flip-Chip Ball Grid Array Package
When developing solder constitutive models or investigating effects such as aging, stress triaxiality due to underfilling, thermal and power cycling combined or just optimizing integrated circuits geometry, researchers use board-level finite element (FE)
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Erwin-Christian Lovasz· Inocentiu Maniu· Ioan Doroftei · Mircea Ivanescu · Corina-Mihaela Gruescu Editors
New Advances in Mechanisms, Mechanical Transmissions and Robotics MTM & Robotics 2020
Mechanisms and Machine Science Volume 88
Series Editor Marco Ceccarelli, Department of Industrial Engineering, University of Rome Tor Vergata, Roma, Italy Editorial Board Alfonso Hernandez, Mechanical Engineering, University of the Basque Country, Bilbao, Vizcaya, Spain Tian Huang, Department of Mechatronical Engineering, Tianjin University, Tianjin, China Yukio Takeda, Mechanical Engineering, Tokyo Institute of Technology, Tokyo, Japan Burkhard Corves, Institute of Mechanism Theory, Machine Dynamics and Robotics, RWTH Aachen University, Aachen, Nordrhein-Westfalen, Germany Sunil Agrawal, Department of Mechanical Engineering, Columbia University, New York, NY, USA
This book series establishes a well-defined forum for monographs, edited Books, and proceedings on mechanical engineering with particular emphasis on MMS (Mechanism and Machine Science). The final goal is the publication of research that shows the development of mechanical engineering and particularly MMS in all technical aspects, even in very recent assessments. Published works share an approach by which technical details and formulation are discussed, and discuss modern formalisms with the aim to circulate research and technical achievements for use in professional, research, academic, and teaching activities. This technical approach is an essential characteristic of the series. By discussing technical details and formulations in terms of modern formalisms, the possibility is created not only to show technical developments but also to explain achievements for technical teaching and research activity today and for the future. The book series is intended to collect technical views on developments of the broad field of MMS in a unique frame that can be seen in its totality as an Encyclopaedia of MMS but with the additional purpose of archiving and teaching MMS achievements. Therefore, the book series will be of use not only for researchers and teachers in Mechanical Engineering but also for professionals and students for their formation and future work. The series is promoted under the auspices of International Federation for the Promotion of Mechanism and Machine Science (IFToMM). Prospective authors and editors can contact Mr. Pierpaolo Riva (publishing editor, Springer) at: [email protected] Indexed by SCOPUS and Google Scholar.
More information about this series at http://www.springer.com/series/8779
Erwin-Christian Lovasz Inocentiu Maniu Ioan Doroftei Mircea Ivanescu Corina-Mihaela Gruescu •
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New Advances in Mechanisms, Mechanical Transmissions and Robotics MTM & Robotics 2020
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Editors Erwin-Christian Lovasz Department of Mechatronics Polytechnic University of Timişoara Timișoara, Romania Ioan Doroftei Department of Mechanical Engineering, Mechatronics and Robotics Gheorghe Asachi Technical University of Iasi Iași, Roma
