Effect of Grain Size on Springback and System Energy in Micro V-Bending with Phosphor Bronze Foil
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TRODUCTION
THERE has been a great deal of research recently into size effects in the area of micromanufacturing. The results of this research have prompted the development of microforming technologies where size effects play a significant role in deformation behavior. Size effects can be categorized into three types: density size effect, shape size effect and microstructure size effect.[1] Grain size effect is a type of microstructure size effect which can be easily created and controlled so it has been the topic of much research lately. Geiger et al.[2] and Engel et al.[3] summarized early studies and achievements in microforming in the beginning of the 21st century, and Vollertsen et al.[4] and Fu and Chan[5] reviewed the state-of-the-art microforming progress and advanced technologies individually in recent years. With the advance of micro metal parts and their applications, downstream assembly is confronted with a problem: the springback phenomenon which is inevitable in metal processing.[6] As springback can produce unexpected geometric errors, it can cause ZHI FANG, Research Staff, and ZHENGYI JIANG, Professor, are with the School of Mechanical Materials and Mechatronic Engineering, University of Wollongong, Wollongong, NSW 2522, Australia. Contact e-mail: [email protected] XIAOGANG WANG and CUNLONG ZHOU, Professors, are with the Shanxi Provincial Key Laboratory on Metallurgical Device Design and Theory, Taiyuan University of Science and Technology, Shanxi 030024, China. XIANMING ZHAO, XIAOMING ZHANG, and DI WU, Professors, are with The State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang, China. Manuscript submitted September 25, 2015. Article published online November 16, 2015 488—VOLUME 47A, JANUARY 2016
difficulties when assembling deformed parts. Therefore, a great amount of research has been conducted into the prediction of springback and compensation for it.[7–10] These valued achievements have helped people obtain a better understanding of this unique phenomenon. But it is also widely accepted that the conventional processing theories cannot be directly applied in the microforming field. Because of this, several studies into springback in microforming have been conducted: Gau et al.[11] studied the relationship between the ratio of thickness and grain size and springback angles using three point bending with an annealed brass thin sheet, and concluded that when the thickness of material is less than 350 lm, the conventional springback theory does not apply. Liu et al.[12] modeled three point bending with commercial finite element (FE) software ABAQUS/ standard. The elastic properties in the simulation were connected with the elastic anisotropy which represents different Young’s moduli in different grain orientations. Fang et al.[13] combined the Voronoi tessellations and grain heterogeneity in an FE model to offer more accurate springback predations for micro V-bending. Gupta et al.[14] proposed a crystal plasticity model which used strain gradient hardening in order to investigate the impa
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