Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coex
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ARTICLE
POLYMER SCIENCE
https://doi.org/10.1007/s10118-021-2524-0 Chinese J. Polym. Sci.
Foam/Film Alternating Multilayer Structure with High Toughness and Low Thermal Conductivity Prepared via Microlayer Coextrusion Qi Luoa,b, Hong-Ting Pua,b*, Zhi-Hua Zhangc, Xiong Zhanga, and Cheng-Long Yuc a Department of Polymeric Materials, School of Materials Science & Engineering, Tongji University, Shanghai 201804, China b Key Laboratory of Advanced Civil Engineering Materials (Ministry of Education), Tongji University, Shanghai 201804, China c School of Physics Science and Engineering & Shanghai Key Laboratory of Special Artificial Microstructure Materials and Technology, Tongji University, Shanghai
200092, China
Electronic Supplementary Information Abstract Multilayer membranes prepared via microlayer coextrusion have attracted wide attention due to their unique properties and broad applications. In present study, the foam/film alternating multilayer sheets based on ethylene-vinyl acetate copolymer (EVA) and high-density polyethylene are successfully prepared via microlayer coextrusion. The cells in the sheets are single-cell-array along the foamed EVA layers with uniform cell size. In addition, the effects of layer number and foam relative thickness on morphology, mechanical properties, damping and heat insulation properties are investigated. The cell size decreases significantly with increasing layer number due to the enhanced confine effects. The tensile strength, elongation at break, and heat insulation also increase significantly. However, the mechanical damping properties change little in the observed frequency. Meanwhile, with higher relative thickness of EVA foam, the sheets have lower tensile strength and lower thermal conductivity, while the damping properties are enhanced in a specific frequency scope. The elongation at break of the optimized sample comes to 800% and the thermal conductivity decreases to 61 mW·m−1·K−1, which shows high toughness and low thermal conductivity, indicating a possible method for preparing materials with high toughness and heat-insulating properties. Keywords Multilayer; Foam; Coextrusion; Toughness; Thermal conductivity Citation: Luo, Q.; Pu, H. T.; Zhang, Z. H.; Zhang, X.; Yu, C. L. Foam/film alternating multilayer structure with high toughness and low thermal conductivity prepared via microlayer coextrusion. Chinese J. Polym. Sci. https://doi.org/10.1007/s10118-021-2524-0
INTRODUCTION Polymeric foams are widely used in packaging, insulation, aeronautic, automotive, and construction industries due to their light weight, high specific strength, low thermal conductivity, and high performance cushion compared to non-foamed polymers.[1−6] However, the conventional bulky foams for thermal insulation usually have poor mechanical properties, which are seldom used alone. In daily applications, polymeric foams often need to be glued or bonded with other high strength materials in order to distribute load over broad areas. The process is time-consuming, complex and costly
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