Reliability of inkjet printed silver nanoparticle interconnects on deformable substrates tested through an electromechan
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Research Letter
Reliability of inkjet printed silver nanoparticle interconnects on deformable substrates tested through an electromechanical in-situ technique Martina Aurora Costa Angeli, Department of Chemistry, Materials and Chemical Engineering “Giulio Natta”, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy Tobias Cramer, and Beatrice Fraboni, Department of Physics and Astronomy, University of Bologna, Viale Berti Pichat 6/2, 40127 Bologna, Italy Luca Magagnin, Dario Gastaldi, and Pasquale Vena, Department of Chemistry, Materials and Chemical Engineering “Giulio Natta”, Politecnico di Milano, Piazza Leonardo da Vinci 32, 20133 Milano, Italy Address all correspondence to Martina Aurora Costa Angeli at [email protected] (Received 28 October 2018; accepted 14 January 2019)
Abstract Inkjet printing is a promising technology providing cost-effective method for processing various materials on deformable substrates. In this work, linear and serpentine inkjet printed interconnects on two different substrates were fabricated and electromechanically characterized. A particular attention was given to the optimization of the process parameters; high quality can be achieved only printing slowly in vertical direction and optimizing the drop spacing to the specific pattern. The electromechanical results showed that the geometrical layout and printing direction strongly affect the printing quality and the electromechanical response; serpentine shapes should be preferred to straight interconnects as better gauge factors are obtained.
Introduction Inkjet printing is a relatively new and promising technology for fabrication; its major advantages, compared with traditional photolithography, rely on fabrication costs reduction, reduced material waste, and simpler manufacturing steps. It is a drop on demand non-contact process, with a large variety of printable substrates and the capacity to reproduce fine features (30 μm maximum resolution).[1] This technology has gained increasing interest in the fabrication of thin films for flexible and stretchable electronics using new functional nanomaterial inks. This technique allows for the manufacturing of devices such as transistors,[2] flexible antenna,[3] strain sensors,[4] and electrochemical biosensors.[5] Despite these established advantages the reliability of both the fabrication process and the fabricated material systems is still a key point to achieve competitive devices. Moreover, bendable and stretchable electronics require reliable electromechanical interconnects as they are subject to mechanical loading which jeopardizes the integrity of the material itself (the electrical interconnects) or that of the interfaces. A well-established strategy to minimize strains in metal interconnects is in-plane serpentine.[6] Inkjet printing is a suitable choice for the fabrication of this type of deformable interconnections due to the capability to print a wider range of geometries compared with other printing techniques.[7] However, in order to guarantee a s
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