SCF-NiFe 2 O 4 /epoxy composites with high thermal conductivity and electromagnetic interference resistance
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SCF-NiFe2O4/epoxy composites with high thermal conductivity and electromagnetic interference resistance Houbao Liu1, Renli Fu1,*
1
, Xinqing Su1, He Wang1, Binyong Wu1, and Qinjiang He1
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
Received: 31 December 2019
ABSTRACT
Accepted: 9 October 2020
With the development of electronic components towards high power, high packaging density, and miniaturization of device size, heat dissipation and the electromagnetic interference problems between the electronic components are emerging. In order to solve the undesirable electromagnetic wave and heat emissions produced by electronic device simultaneously, the electronic packaging materials with high thermal conductivity and anti-electromagnetic interference are highly expected. In this work, NiFe2O4-modified short carbon fibers (SCF) were designed and prepared. NiFe2O4 were in situ grown on the surface of SCF by hydrothermal method. The chemical structure and morphology of SCF-NiFe2O4 were characterized by X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM). The microwave absorbing performance test shows that SCF-NiFe2O4 possess superior microwave absorbing performance, where the minimum reflection loss is - 20.7 dB. Finally, SCF-NiFe2O4/ epoxy resin composites were prepared by introducing SCF-NiFe2O4 as thermal conductive filler into epoxy resin. The surface-modified SCF with NiFe2O4 is more easily infiltrated by resin and exhibits strong interfacial interaction with the matrix. With the increase of the content of SCF-NiFe2O4, the thermal conductivity of the composites increases obviously. When the content of SCFNiFe2O4 reaches 20 vol%, the composites show better thermal conductivity, and the thermal conductivity reaches 1.03 W/m K.
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Springer Science+Business
Media, LLC, part of Springer Nature 2020
1 Introduction In recent years, in order to save space effectively and employ electronic devices conveniently, electronic components tend to be integrated and miniaturized.
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https://doi.org/10.1007/s10854-020-04644-5
These highly integrated electronic components bring two problems when they are running. On the one hand, undesirable electromagnetic interference will disturb the proper functioning of sensitive electronic instruments [1, 2]. On the other hand, significant heat
J Mater Sci: Mater Electron
emissions will seriously shorten the service life of electronic devices [3–7]. Therefore, there is an urgent requirement for an electronic device packaging material with anti-electromagnetic interference and high thermal conductivity to effectively shield undesirable electromagnetic waves and heat dissipation. Due to the advantages of light weight, corrosion resistance, and easy processing, polymer has broad application prospects in the field of microelectronic packaging [8]. Generally, polymer composites with good thermal conductivity can be prepared by adding various
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