Flexible MXene/EPDM rubber with excellent thermal conductivity and electromagnetic interference performance
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Flexible MXene/EPDM rubber with excellent thermal conductivity and electromagnetic interference performance Shaowei Lu1 · Bohan Li1 · Keming Ma1 · Sai Wang1 · Xingmin Liu1 · Ziang Ma1 · Lunyang Lin2 · Guannan Zhou2 · Dongxu Zhang2 Received: 22 April 2020 / Accepted: 27 May 2020 © Springer-Verlag GmbH Germany, part of Springer Nature 2020
Abstract In this study, a rubber composite was prepared based on two-dimensional (2D) material (MXene) and ethylene propylene diene rubber (EPDM). The MXene was efficiently prepared by etching Ti3AlC2 powder with LiF-HCl solution and subsequent vacuum drying, and the dispersion of MXene in EPDM was improved by optimizing the grinding process, ultrasonic stripping and stirring method. In the process of exploring the electrical conductivity of this material system, the composite exhibits low percolation threshold of 2.7 wt%, a high conductivity of 106 Sm−1 and superior thermal conductivity of 1.57 W/m K at the MXene content of 6 wt%. In addition, MXene (6 wt%)/EPDM with 0.3-mm thick exhibits an EMI shielding performances (SE) up to 48 dB in the X-band (8.2–12.4 GHz) and 52 dB in the Ku-band (12.4–18 GHz) (SE) which are much better than the electromagnetic shielding properties of other rubber blends, and these properties indicate MXene/EPDM composite has great potential for versatile applications. Keywords Two-dimensional materials (MXene)/EPDM · Percolation threshold · Thermal conductivity · Electromagnetic interference shielding
1 Introduction With the rapid development of modern electronic industry, electronic appliances and wireless communication are widely used, and electromagnetic interference (EMI) has become an urgent problem need to be solved in electronic industry and daily life [1–3], at the same time, a lot of heat is generated by some electronics, which can harm the performance and lifetime of these source electronics and other nearby electronics [4]. Therefore, EMI shielding and thermal dispersion are indispensable in the design and application of electronic devices, and excellent flexible materials for electromagnetic shielding and thermal dispersion are imminently desired.
* Shaowei Lu [email protected] 1
Faculty of Materials Science and Engineering, Shenyang Aerospace University (SAU), Shenyang 110136, China
Faculty of Aeronautical and Astronautical Engineering, Shenyang Aerospace University (SAU), Shenyang 110136, China
2
Metals and alloys, the most commonly used for EMI shielding material, not only have excellent conductivity, but also have the function of absorbing and reflecting electromagnetic interference [5]. However, the large density, poor flexibility and limited thermal conductivity limit their range of application and effect of use [6]. In order to solve these problems, various alternative nanomaterials are used to design EMI materials, such as carbon nanotubes (CNTs)based composites [7, 8] and graphene-based composites [9]. The EMI shielding materials are designed reasonably by CNTs, but in general, the EMI shielding of CNTs-based com
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