Second Annual Self-Healing Conference to Be Held in Chicago
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Second Annual Self-Healing Conference to Be Held in Chicago http://conferences.beckman.uiuc.edu/ICSHM2009 The Second International Conference on Self-Healing Materials will be held on June 28–July 1, 2009, in Chicago. The conference will encompass various classes of self-healing materials, including polymers, ceramics, metals, and composites, while biomaterials and bio-inspiration serve as model systems that guide research in the emergent field of selfhealing. The conference is chaired by Scott White of the Beckman Institute
within the University of Illinois at Urbana-Champaign and Ian Bond from the University of Bristol in England. The conference is endorsed by the Materials Research Society. The conference will feature general topics and special symposia. General topics include areas such as self-healing polymers, microvascular systems, and selfhealing coatings and paints, while the special symposia are being organized in a
variety of areas, including self-healing supramolecular polymers, numerical analysis tools for self-healing, and mechanochemically active polymers. The deadline for early fee registration is March 4, 2009. The first International Conference on Self-Healing Materials was held in the Netherlands in 2007 and included more than 200 researchers from around the world.
CONFERENCE REPORTS
The International Integrated Reliability Workshop Held October 2008 www.iirw.org The International Integrated Reliability Workshop (IIRW) was held on October 12–16, 2008 in the Stanford Sierra Camp in California. The workshop, organized by Patrick Lenahan of The Pennsylvania State University and Guoqiao Tao of NXP, offered six tutorials, seven sessions with 24 talks, and a poster session. Workshop attendees came from industry, universities, and research institutes. The workshop focused on ensuring electronic device reliability through fabrication, design, testing, characterization, and simulation, as well as identification of the defects and physical mechanisms responsible for reliability problems. Subramanyan Dakshinamoorthy Pat Lenahan (left) of The Pennsylvania State University of Freescale Semiconductor present(Penn State) served as the General Chair and Guoqiao ed the keynote address on qualificaTao of NXP served as the Technical Program Chair of tion strategies, showing the growing the International Integrated Reliability Workshop. number of complex elements that are required to assure a proper and automatically compensate for it to design for reliability and enable the delivavoid any additional reliability guard ery of zero defects quality and reliability bands. He said that this circuitry conproducts. The first tutorial was given by sumes only a small additional space on S. Mitra (Stanford Univ.) on circuit failure the respective products. T. Grasser (Techprediction for robust system design in nical Univ. of Vienna) gave a tutorial on scaled complementary metal oxide seminegative bias temperature instability conductors (CMOS). He encouraged the (NBTI). His reliability simulations and audience to make use
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