The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature
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https://doi.org/10.1007/s11664-020-08426-x 2020 The Minerals, Metals & Materials Society
The Fabrication of Ni-MWCNT Composite Solder and Its Reliability Under High Relative Humidity and Temperature CHOONG-JAE LEE,1 KYUNG DEUK MIN,1 HAKSAN JEONG,1 BYEONG-UK HWANG,1 and SEUNG-BOO JUNG 1,2 1.—School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon 16419, Republic of Korea. 2.—e-mail: [email protected]
Ni decorated multi-walled carbon nanotube (Ni-MWCNT) composite solders have been fabricated using Ni-MWCNT composite materials and Sn58Bi solder alloys. Ni-MWCNT composite materials were synthesized with functionalization, reduction and electroless plating. The Ni-MWCNT composite solders were fabricated at various weight percentages (0, 0.05, 0.1 and 0.2 wt.%) of NiMWCNT. The mechanical properties of Ni-MWCNT composite solder were evaluated using ball shear tests. The shear strength and fracture energy were improved about 16.02% and 12.60%, respectively, by adding 0.1 wt.% of NiMWCNTs, which released the stress in the solder alloy. The environmental reliability was examined at 85C with 85% relative humidity at various holding times. After environmental reliability testing, the microstructure was analyzed to characterize the grain and intermetallic layers. The growth of grains and intermetallic layer thickness were mitigated by Ni-MWCNTs in the solder matrix that affected the mechanical properties. The distribution of Ni-MWCNTs inside the solder joints was confirmed by EPMA and Raman spectroscopy. Key words: Composite, interconnection, solder, microstructure, MWCNT
INTRODUCTION The miniaturization trend in electronic packaging is unavoidable as the requirements for high performance electronic devices trend upward.1–3 Furthermore, as lower pitch size leads to problems such as warpage failure, reliability issues plague the industry and electromigration problems have been spotlighted.4–7 The interconnection materials of electronic packages have therefore never been more important. The solder alloys which serve as interconnection-materials play a vital role as thermal and electrical pathways in the mechanical assembly of parts.8–11 Various Sn-based alloy systems such as Sn-Bi-Ag systems, Sn-Ag-Cu systems, and Sn-In systems have been researched to address the
(Received May 28, 2020; accepted August 14, 2020)
requirements of advanced electronic packaging; usage of suitable solder alloy systems has become very important.12–14 The Sn58Bi solder alloys are attractive due to their remarkable shear strength and creep resistance.15,16 Sn58Bi solder can form interconnections at low temperature due to its 138C melting temperature. The low melting point temperature of Sn58Bi solder alloys can reduce thermal damage to electronic components during the reflow process. Associated problems of warpage and process costs are also reduced by low processing temperatures.17–19 However, Sn58Bi solders suffer from critical problems of low ductility and poor environmental reliability.20,21
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