Three-Dimensional Integration of Semiconductors Processing, Material
This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations.&
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Kazuo Kondo • Morihiro Kada • Kenji Takahashi Editors
Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
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Editors Kazuo Kondo Department of Chemical Engineering Osaka Prefecture University Osaka Japan
Kenji Takahashi Toshiba Corporation Oita Japan
Morihiro Kada Osaka Prefecture University Osaka Japan
ISBN 978-3-319-18674-0 ISBN 978-3-319-18675-7 (eBook) DOI 10.1007/978-3-319-18675-7 Library of Congress Control Number: 2015943688 Springer Cham Heidelberg New York Dordrecht London © Springer International Publishing Switzerland 2015 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors, and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. Printed on acid-free paper Springer International Publishing AG Switzerland is part of Springer Science+Business Media (www.springer.com)
Preface
The concept of three-dimensional integration of semiconductors originated with the US patent by IBM in 1969. The patent is titled “Hourglass-shaped conductive connection through semiconductor structures” (http://www.google.com.mx/ patents/US3648131). The original interconnect looks like an hourglass. Since 1969, the three-dimensional integration concept has spread out to semiconductor industries all over the world and more than 40 consortia and companies have been involved in this development. Forty-five years after its invention, three-dimensional integration of semiconductors is becoming very popular, and is about to be industrialized in advanced electronics in the very near future. This book reviews the state of the art of three-dimensional semiconductor integration. Chapter 1 gives an overview of three-dimensional integration research and development history. Chapter 2 summarizes recent three-dimensional integration research and development activities and applications. Chapter 3 gives an explanation of through-silicon via (TSV) formation processes. Chapters 4 and 5 cover wafer handling, wafer thinning, and bonding of wafers and dies. Chapter 6 explains metrology and inspection. Chapter 7 discusses
