Aluminum-Based Metallurgy for Global Interconnects
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the interaction between the various components of this system can affect the performance of the interconnect. For example, the intermetal dielectric changes the mechanical stress in the interconnect;1 the presence of W plugs in vias can affect the electromigration resistance of interconnects.2 In this article, we will examine the problems that are encountered when using Al alloys as a global interconnect and illustrate how the material properties can be modified to solve these problems.
Requirements for Global Interconnects A metallization system used for global interconnects has to satisfy the following minimum conditions (many of the electrical values listed here are the upper
Passivation I Metal 2 int e rm e t
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