Electronics Packaging Materials Research at NIST
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MICHAEL A. SCHEN*, G.T. DAVIS*, F.I. MOPSIK*, W.L. WU*, W. E. WALLACE*, JR. MANNING**, C.A. HANDWERKER**, D.T. READ*** *Polymers Division, **Metallurgy Division, ***Materials Reliability Division Materials Science and Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899 USA ABSTRACT The Materials Science and Engineering Laboratory at NIST has augmented its laboratory-based research in support of the U.S. commercial microelectronics industry by expanding its efforts in electronics packaging, interconnection and assembly (P/I/A) materials technologies. In conjunction with industry, university and other government agency partners, these new NIST efforts target materials technology issues that underlie the priorities contained within the various electronics industry technology roadmaps. A dominant aspect of the laboratory P/I/A program focuses on the in-situ metrology and data needs associated with the materials and complex material assemblies which comprise today's microelectronic components and circuits. BACKGROUND Integrated circuits and printed wiring boards are the two most strategic and pervasive electronic components which impact the U.S. electronics industry and modem life [1]. In 1994 the worldwide semiconductor electronics market was valued at over $100 billion a year and the module interconnection industry at over $21 billion worldwide [2]. The North American market share of these two electronics industry segments amounted to $33 billion in semiconductors and $5.5 billion in interconnection [2][3]. The U.S. microelectronics industry is being confronted with technological change at an unprecedented pace. This is due to increased consumer expectations, rapid product evolutions, and heightened international competition. In response, the U.S. semiconductor industry, through the Semiconductor Industry Association (SIA), and the module interconnection industry, through the Institute for Interconnecting and Packaging Electronic Circuits (IPC), have developed technology roadmaps to identify technology roadblocks and enablers for manufacturing competitive products [4][5]. A key element contained in these roadmaps is the packaging, interconnection and assembly of semiconductor components and printed wiring boards. The advent of the roadmap process is a key development in this period of dwindling corporate research and development investment and heightened international pressure. In this process, planners, administrators and practitioners from all segments of the microelectronics supply chain have created a vision of advances needed to support future products. This includes identification of critical technical needs, potential paradigm shifts and grand challenges. One such grand challenge is the effective involvement of the U.S. materials industry to develop improvements in fundamental understanding and to provide new cost effective materials technology into microelectronic products. Thus, the technology roadmaps provide a basis for cooperation and partnerships between industry
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