Modeling and Application of Flexible Electronics Packaging
This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling
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Modeling and Application of Flexible Electronics Packaging
Modeling and Application of Flexible Electronics Packaging
YongAn Huang Zhouping Yin Xiaodong Wan •
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Modeling and Application of Flexible Electronics Packaging
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YongAn Huang State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology (HUST) Wuhan, People’s Republic of China
Zhouping Yin State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology (HUST) Wuhan, People’s Republic of China
Xiaodong Wan State Key Laboratory of Digital Manufacturing Equipment and Technology Huazhong University of Science and Technology (HUST) Wuhan, People’s Republic of China
ISBN 978-981-13-3626-3 ISBN 978-981-13-3627-0 https://doi.org/10.1007/978-981-13-3627-0
(eBook)
Jointly published with Science Press, Beijing, China The print edition is not for sale in China Mainland. Customers from China Mainland please order the print book from: Science Press, Beijing, China. Library of Congress Control Number: 2018968102 © Science Press and Springer Nature Singapore Pte Ltd. 2019 This work is subject to copyright. All rights are reserved by the Publishers, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publishers, the authors, and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publishers nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publishers remain neutral with regard to jurisdictional claims in published maps and institutional affiliations. This Springer imprint is published by the registered company Springer Nature Singapore Pte Ltd. The registered company address is: 152 Beach Road, #21-01/04 Gateway East, Singapore 189721, Singapore
Foreword
Flexible electronics represent the next-generation microelectronics that offer the electrical functions of conventional, rigid IC technologies but with the ability to be stretched, compressed, twisted, bent, and deformed into arbitrary shapes. They overcome the fundamental mismatch in mechanics and form and have enabled applications that are impossible to achieve with hard, planar integrated circuits. Their representative applications include epidermis electronics that are co
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