Nanopackaging Nanotechnologies and Electronics Packaging
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a road
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Nanopackaging Nanotechnologies and Electronics Packaging Second Edition
Nanopackaging
James E. Morris Editor
Nanopackaging Nanotechnologies and Electronics Packaging Second Edition
Editor James E. Morris Department of Electrical and Computer Engineering Portland State University Portland, OR, USA
ISBN 978-3-319-90361-3 ISBN 978-3-319-90362-0 https://doi.org/10.1007/978-3-319-90362-0
(eBook)
Library of Congress Control Number: 2018947583 © Springer International Publishing AG, part of Springer Nature 2018 This work is subject to copyright. All rights are reserved by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, express or implied, with respect to the material contained herein or for any errors or omissions that may have been made. The publisher remains neutral with regard to jurisdictional claims in published maps and institutional affiliations. Printed on acid-free paper This Springer imprint is published by the registered company Springer Nature Switzerland AG The registered company address is: Gewerbestrasse 11, 6330 Cham, Switzerland
Foreword to the First Edition
Semiconductors entered the nanotechnology era when they went below the 100 nm technology node a few years ago. Today the industry is shipping 65 nm technology wafers in high volume, 45 nm is in production, with 32 nm working at the development stage. While the predictions that Moore’s law has reached its practical limits have been heard for years, they have proven to be premature. And it is expected that the technology will continue to move forward unabated for some years before it comes close to the basic physical limits to CMOS scaling. Consumers are becoming the dominant force for electronic products. The industry has learnt that the consumer market is driven by many factors other than CMOS scaling alone. Functional diversification, accomplished through integration of multiple circuit types, and different device types such as MEMs, optoelectronics, chemical and biological sensors, and others provide electronic product designers with different functional capabilities meeting the needs, wants, and tastes of consumers. This functional diversification together with cost, weight, size,
