Embedded Software Design and Programming of Multiprocessor System-on-Chip
Embedded Software Design and Programming of Multiprocessor System-on-Chip: Simulink and SystemC Case Studies Katalin Popovici Frédéric Rousseau Ahmed Jerraya, Marilyn Wolf Current multimedia and telecom applications require complex, heterogeneous m
- PDF / 3,522,730 Bytes
- 246 Pages / 459.967 x 757.375 pts Page_size
- 19 Downloads / 241 Views
Embedded Software Design and Programming of Multiprocessor System-on-Chip Simulink and System C Case Studies Katalin Popovici · Frédéric Rousseau Ahmed A. Jerraya · Marilyn Wolf
1 23
Embedded Systems
Series Editors Nikil D. Dutt, Department of Computer Science, Zot Code 3435, Donald Bren School of Information and Computer Sciences, University of California, Irvine, CA 92697-3435, USA Peter Marwedel, TU Dortmund, Informatik 12, Otto-Hahn-Str. 16, 44227 Dortmund, Germany Grant Martin, Tensilica Inc., 3255-6 Scott Blvd., Santa Clara, CA 95054, USA
For further volumes: http://www.springer.com/series/8563
Katalin Popovici · Frédéric Rousseau · Ahmed A. Jerraya · Marilyn Wolf
Embedded Software Design and Programming of Multiprocessor System-on-Chip Simulink and SystemC Case Studies
123
Katalin Popovici MathWorks, Inc. 3 Apple Hill Dr. Natick MA 01760 USA [email protected]
Frédéric Rousseau Laboratoire TIMA 46 av. Felix Viallet 38031 Grenoble CX France [email protected]
Ahmed A. Jerraya Laboratoire TIMA 46 av. Felix Viallet 38031 Grenoble CX France [email protected]
Marilyn Wolf Georgia Institute of Technology Electrical & Computer Engineering Dept. 777 Atlantic Drive NW. Atlanta GA 30332-0250 Mail Stop 0250 USA [email protected]
ISBN 978-1-4419-5566-1 e-ISBN 978-1-4419-5567-8 DOI 10.1007/978-1-4419-5567-8 Springer New York Dordrecht Heidelberg London Library of Congress Control Number: 2009943586 © Springer Science+Business Media, LLC 2010 All rights reserved. This work may not be translated or copied in whole or in part without the written permission of the publisher (Springer Science+Business Media, LLC, 233 Spring Street, New York, NY 10013, USA), except for brief excerpts in connection with reviews or scholarly analysis. Use in connection with any form of information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed is forbidden. The use in this publication of trade names, trademarks, service marks, and similar terms, even if they are not identified as such, is not to be taken as an expression of opinion as to whether or not they are subject to proprietary rights. Printed on acid-free paper Springer is part of Springer Science+Business Media (www.springer.com)
Acknowledgments
The authors would like to thank for the very useful comments of the book reviewers, which contributed a lot to improve the book, and the remarks and suggestions of all the persons for reading parts of the manuscript. We would especially like to thank Grant Martin (Tensilica Inc., USA), Tiberiu Seceleanu (ABB Corporate Research, Sweden), Soo Kwan Eo (Samsung Electronics’SoC R&D Center, Korea), Frank Schirrmeister (Synopsys Inc., USA), Lovic Gauthier (Fukuoka Laboratory for Emerging & Enabling Technology of SoC, Japan), Jason Agron (University of Arkansas, USA), Wido Kruijtzer (NXP Semiconductors, Eindhoven, Netherlands), Felice Balarin (Cadence, San Jose CA, USA), Pierre Paulin (STMicroelectronics, Ottawa, Can
Data Loading...