Enhanced heat dissipation performance of chemical-doped graphene for flexible devices
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Journal of the Korean Physical Society https://doi.org/10.1007/s40042-020-00014-w
ORIGINAL PAPER
Enhanced heat dissipation performance of chemical‑doped graphene for flexible devices Yung‑Bin Chung1,2 · Dmitry Kireev2 · Myungsoo Kim2 · Deji Akinwande2 · Sung‑Joo Kwon1 Received: 27 October 2020 / Revised: 6 November 2020 / Accepted: 10 November 2020 © The Korean Physical Society 2020
Abstract As the rapid development of electronic technology, the amount of unavoidable heat from electronic components is also increasing. Therefore, the demand for efficient heat dissipation materials with high performance is continuously increasing. Graphene is one of the best candidates in terms of heat dissipation property and intrinsic flexibility. In this work, we show that chemical doping is an effective way to additionally improve the heat dissipation property of large-scale CVD grown monolayer graphene. We found that heat dissipation property of monolayer graphene, chemically doped with H NO3 and PFSA improves by the 9.94% and 4.12% compared with pristine graphene, respectively. Moreover, it shows the stable heat dissipation property after bending test. Keywords Graphene · Heat dissipation · Chemical doping · Bending · Resistivity · Raman spectroscopy
1 Introduction Electronics circuits have millions and even billions of transistors. The density of transistors could be higher and the clock speed and frequency would be faster [1]. As such, the amount of generated heat from electronic components would be increased and is an unavoidable byproduct when operation of electronic devices such as smartphone and laptop. Moreover, lithium-ion batteries also generate the heat during operation [2]. Therefore, heat management is one of the biggest issues in electronics devices because the heat would increase the temperature of electronic devices [3] and it would make random errors and finally deteriorate the reliability and performance. As we mentioned, the heat source of the smartphone is application processor (AP) and battery. To effectively dissipate the generated heat from AP and battery, most of the smartphones use the passive cooling system with heat pipe and heat sink. The technology is such that one side of heat pipe contacts to AP directly and the other side contacts to * Yung‑Bin Chung [email protected] 1
Samsung Display Company, Giheung‑Gu, Yongin‑Si, Gyeonggi‑Do 17113, South Korea
Microelectronics Research Center, The University of Texas, Austin, TX, USA
2
heat sinks such as display, metal bracket, and backplate. To transfer the heat effectively from AP and battery to heat sink, the temperature difference between heat source and heat sink is a major parameter. The temperature of heat sink should ideally be as low as possible. Therefore, most heat sinks such as display, metal bracket, and backplate use the heat dissipation material which is placed between heat pipe and heat sink. The heat dissipation material should be attached to backside of the display and front side of backplate to spread the heat of heat si
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