Fundamentals of Electromigration in Interconnects of 3D Packaging

Micro bumps, through Si vias (TSV), and redistribution layers (RDL) or back-end-of-line (BEOL) layers that connected to the TSV are unique interconnects connecting the stacked Si dies in 3D packaging. Electromigration (EM) failure has been a concern for t

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Yan Li Deepak Goyal   Editors

3D Microelectronic Packaging From Architectures to Applications Second Edition

Springer Series in Advanced Microelectronics Volume 64

Series Editors Kukjin Chun, Department of Electrical and Computer Engineering, Seoul National University, Seoul, Korea (Republic of) Kiyoo Itoh, Hitachi Ltd., Tokyo, Japan Thomas H. Lee, Department of Electrical Engineering CIS-205, Stanford University, Stanford, CA, USA Rino Micheloni, Torre Sequoia, II piano, PMC-Sierra, Vimercate, MB, Italy Takayasu Sakurai, The University of Tokyo, Tokyo, Japan Willy M. C. Sansen, ESAT-MICAS, Katholieke Universiteit Leuven, Leuven, Belgium Doris Schmitt-Landsiedel, Lehrstuhl fur Technische Elektronik, Technische Universität München, Munich, Germany

The Springer Series in Advanced Microelectronics provides systematic information on all the topics relevant for the design, processing, and manufacturing of microelectronic devices. The books, each prepared by leading researchers or engineers in their fields, cover the basic and advanced aspects of topics such as wafer processing, materials, device design, device technologies, circuit design, VLSI implementation, and sub-system technology. The series forms a bridge between physics and engineering, therefore the volumes will appeal to practicing engineers as well as research scientists.

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Yan Li Deepak Goyal •


3D Microelectronic Packaging From Architectures to Applications Second Edition


Editors Yan Li Intel Corporation Chandler, AZ, USA

Deepak Goyal Intel Corporation Chandler, AZ, USA

ISSN 1437-0387 ISSN 2197-6643 (electronic) Springer Series in Advanced Microelectronics ISBN 978-981-15-7089-6 ISBN 978-981-15-7090-2 (eBook) 1st edition: © Springer International Publishing Switzerland 2017 2nd edition: © The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Nature Singapore Pte Ltd. 2021 This work is subject to copyright. All rights are solely and exclusively licensed by the Publisher, whether the whole or part of the material is concerned, specifically the rights of translation, reprinting, reuse of illustrations, recitation, broadcasting, reproduction on microfilms or in any other physical way, and transmission or information storage and retrieval, electronic adaptation, computer software, or by similar or dissimilar methodology now known or hereafter developed. The use of general descriptive names, registered names, trademarks, service marks, etc. in this publication does not imply, even in the absence of a specific statement, that such names are exempt from the relevant protective laws and regulations and therefore free for general use. The publisher, the authors and the editors are safe to assume that the advice and information in this book are believed to be true and accurate at the date of publication. Neither the publisher nor the authors or the editors give a warranty, expressed or implied, with res